ASHRAE ThermalGuidelinesforDataProcessingEnvironments 09 2009
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Thermal Guidelines for Data Processing Environments, Second Edition
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2009 | 70 |
Trends toward increased equipment power density in data and communication (datacom) centers can result in significant thermal design and operation issues, with the potentially undesirable side effects of decreased equipment availability, wasted floor space, and inefficient cooling system operation. There is often a mismatch of IT equipment environmental requirements with adjacent equipment requirements or with facility operating conditions and, thus, a strong need to find common solutions and standard practices that facilitate IT equipment interchangeability while preserving industry innovation. This Guide provides equipment manufacturers and facility operations staff with a common set of guidelines for the design and construction of their respective equipment or facility, thereby aiding in maximizing the performance and health of the facility and its contents.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 12 | Figure 1.1 Heat density trends, projections for information technology products. |
| 13 | 1.1 Document Flow |
| 14 | 1.2 Primary Users for This Document |
| 15 | 1.3 Compliance 1.4 Definitions |
| 20 | 2.1 Environmental Conditions |
| 22 | 2.2 Environmental Class Definitions |
| 23 | 2.3 Equipment Environmental Specifications |
| 24 | 2.4 Altitude Rating |
| 25 | Figure 2.1 World population distribution vs. altitude [11]. 2.5 Acoustical Noise Emissions |
| 26 | 3.1 Facility Health and Audit Tests |
| 27 | Figure 3.1 Measurement points in aisle. |
| 28 | Figure 3.2 Measurement points between rows. Figure 3.3 Measurement points in a hot-aisle/cold-aisle configuration. |
| 29 | 3.2 Equipment Installation Verification Tests |
| 30 | Figure 3.4 Monitor points for configured racks. 3.3 Equipment Troubleshooting Tests |
| 31 | Figure 3.5 Monitor points for 1U to 3U equipment. Figure 3.6 Monitor points for 4U to 6U equipment. |
| 32 | Figure 3.7 Monitor points for 7U and larger equipment. |
| 33 | Figure 3.8 Monitor points for equipment with localized cooling. |
| 34 | 4.1 Equipment Airflow |
| 35 | Figure 4.1 Syntax of face definitions. Figure 4.2 Recommended airflow protocol. |
| 36 | 4.2 Equipment Room Airflow Figure 4.3 View of a hot-aisle/cold-aisle configuration. |
| 37 | Figure 4.4 Example of hot and cold aisles with underfloor cooling. |
| 38 | Figure 4.5 Example of hot and cold aisles for non-raised floor. |
| 39 | Figure 4.6 Seven-tile aisle pitch, equipment aligned on cold aisle. Table 4.1 Aisle Pitch Allocation |
| 40 | Figure 4.7 Seven-tile aisle pitch, equipment aligned on hot aisle. |
| 42 | 5.1 Providing Heat Release and Airflow Values |
| 43 | 5.2 Equipment Thermal Report |
| 49 | Figure A.1 Allowable Class 1-4 operating conditions (SI units). |
| 50 | Figure A.2 Allowable Class 1-4 operating conditions (I-P units). |
| 51 | Figure A.3 Allowable data center and NEBS operating conditions (SI units). |
| 52 | Figure A.4 Allowable data center and NEBS operating conditions (I-P units). |
| 53 | Figure A.5 Recommended data center and central office operating conditions (SI units). |
| 54 | Figure A.6 Recommended data center and central office operating conditions (I-P units). |
| 56 | Figure B.1 Class 1-4 temperature vs. altitude. |
| 57 | Figure B.2 Class 1, Class 2, and NBES temperature vs. altitude. |
| 59 | Table C.1 Comparison of 2004 and 2008 Recommended Environmental Envelope Data |
| 60 | Dry-Bulb Temperature Limits Low End |
| 61 | Figure C.1 2008 recommended environmental envelope (new Class 1 and 2). |
| 62 | High End Figure C.2 Inlet and component temperatures with fixed fan speed. |
| 63 | Figure C.3 Inlet and component temperatures with variable fan speed. |
| 64 | Moisture Limits High End |
| 65 | Low End |
| 66 | Acoustical Noise Levels |
| 67 | Data Center Operation Scenarios for ASHRAE’s 2008 Recommended Environmental Limits |
| 68 | References |
