BS EN 16602-70-61:2022
$215.11
Space product assurance. High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections
| Published By | Publication Date | Number of Pages |
| BSI | 2022 | 256 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 23 | 1 Scope |
| 24 | 2 Normative references |
| 26 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard |
| 31 | 3.3 Abbreviated terms |
| 33 | 3.4 Nomenclature |
| 34 | 4 Principles of reliable soldered connections |
| 35 | 5 Preparatory conditions 5.1 Facility cleanliness 5.2 Environmental conditions |
| 36 | 5.3 Lighting requirements 5.4 Precautions against static discharges 5.4.1 Overview |
| 37 | 5.4.2 General 5.4.3 ESD Protected Area |
| 38 | 5.4.4 Precautions against ESD during manufacturing |
| 39 | 5.4.5 Protective packaging and ESD protection 5.5 Equipment and tools 5.5.1 General |
| 40 | 5.5.2 Brushes 5.5.3 Cutters and pliers |
| 41 | 5.5.4 Bending tools 5.5.5 Clinching tools |
| 42 | 5.5.6 Insulation strippers 5.5.6.1 Thermal strippers 5.5.6.2 Precision mechanical cutting-type strippers |
| 43 | 5.5.6.3 Enamel stripping for wires 5.5.6.4 Verification of stripping tools 5.5.7 Hot air blower 5.5.8 Soldering tools 5.5.8.1 General 5.5.8.2 Holding tools 5.5.8.3 Thermal shunts |
| 44 | 5.5.8.4 Anti-wicking tools 5.5.8.5 Soldering irons 5.5.9 Baking and curing ovens |
| 45 | 5.5.10 Solder deposition equipment 5.5.11 Automatic component placement equipment 5.5.12 Dynamic wave-solder machines |
| 46 | 5.5.13 Selective wave solder equipment |
| 47 | 5.5.14 Reflow process equipment 5.5.14.1 Condensation (vapour phase) reflow machines 5.5.14.2 Local hot gas reflow machines |
| 48 | 5.5.14.3 Forced convection and infrared reflow systems 5.5.14.4 Other equipment for reflow soldering 5.5.14.5 Reflow process control parameters |
| 49 | 5.5.15 Depanelization tool 5.5.16 Cleanliness testing equipment 5.5.17 Optical microscope 5.5.18 Automatic Optical Inspection (AOI) equipment 5.5.19 X-ray inspection equipment |
| 51 | 6 Material selection 6.1 General 6.2 Solder 6.2.1 Form |
| 52 | 6.2.2 Composition |
| 54 | 6.2.3 Storage and handling of paste purity 6.3 Fluxes 6.3.1 Rosin based fluxes |
| 55 | 6.4 Solvents |
| 56 | 6.5 Flexible insulation materials 6.6 Terminals 6.6.1 Materials 6.6.2 Tin, silver, and gold-plated terminals |
| 57 | 6.7 Wires 6.8 Sculptured flex 6.9 Printed circuits substrates 6.9.1 Substrates selection 6.9.2 Gold finish on PCBs footprint |
| 58 | 6.9.3 PCB design requirements for wave and selective wave soldering 6.10 Components 6.10.1 General |
| 59 | 6.10.2 Moisture sensitive components 6.11 Adhesives, potting, underfill and conformal coatings |
| 60 | 7 Preparations prior to mounting and soldering 7.1 General handling 7.2 Storage 7.2.1 Components 7.2.2 PCBs 7.2.3 Materials requiring segregation |
| 61 | 7.3 Baking conditions of PCBs 7.4 Baking and storage of moisture sensitive components |
| 62 | 7.5 Preparation of components, wires, terminals, and solder cups 7.5.1 Damage to insulation 7.5.2 Damage to conductors and braid |
| 63 | 7.5.3 Cleaning before soldering 7.5.4 Insulation clearance 7.5.5 Wire lay 7.6 Degolding and pretinning 7.6.1 General |
| 64 | 7.6.2 Solder baths method for degolding and pretinning of components terminations and terminals |
| 66 | 7.6.3 Solder iron method for degolding and pretinning 7.6.3.1 PCB 7.6.3.2 Components terminations 7.6.3.3 Solder cup 7.6.4 Pretinning processes 7.6.4.1 Pretinning of pure tin finish component leads |
| 67 | 7.6.4.2 Solder bath method for pretinning of stranded wires 7.6.4.3 Solder iron method for pretinning of wires and braids 7.6.4.4 Requirements for pretinning of wires 7.7 Preparation of the soldering tip |
| 69 | 8 Components mounting requirements prior to soldering 8.1 General requirements 8.2 Mounting of through hole components 8.2.1 General |
| 70 | 8.2.2 Heavy components 8.2.3 Metal-case components 8.2.4 Glass-encased components 8.2.5 Stress relief of components with bendable leads |
| 73 | 8.2.6 Stress relief of components with non-bendable leads |
| 74 | 8.2.7 Bending of component leads |
| 75 | 8.2.8 Lead attachment to PCBs 8.2.8.1 General 8.2.8.2 Stud leads |
| 77 | 8.2.8.3 Clinching of components in non-plated through holes |
| 78 | 8.2.9 Mounting of through hole connectors to PCBs |
| 79 | 8.2.10 Mounting of swage terminals to PCBs |
| 80 | 8.2.11 Mounting of components to terminals |
| 81 | 8.3 Mounting of surface mount components 8.3.1 General |
| 82 | 8.3.2 Lead forming 8.3.3 Inspection of solder paste deposition |
| 83 | 9 Attachment of conductors to terminals, solder cups and cables 9.1 General 9.2 Wire termination 9.2.1 Breakouts from cables |
| 84 | 9.2.2 Insulation clearance 9.3 Turret and straight-pin terminals |
| 85 | 9.4 Bifurcated terminals 9.4.1 General 9.4.2 Bottom route |
| 86 | 9.4.3 Side route |
| 87 | 9.4.4 Top route |
| 88 | 9.4.5 Combination of top and bottom routes 9.4.6 Combination of side and bottom routes 9.5 Hook terminals |
| 89 | 9.6 Pierced terminals 9.7 Solder cups for connector |
| 90 | 9.8 Insulation sleeving |
| 91 | 9.9 Wire and cable interconnections 9.9.1 General 9.9.2 Preparation of wires |
| 92 | 9.9.3 Preparation of shielded wires and cables 9.9.4 Pre-assembly of wires |
| 93 | 9.10 Connection of wires to PCBs |
| 95 | 9.11 Connection of coaxial cables to PCBs |
| 96 | 10 Assembly to terminals and to PCBs 10.1 Overview 10.2 General soldering conditions 10.2.1 General |
| 97 | 10.2.2 Positioning |
| 98 | 10.2.3 Application of flux |
| 99 | 10.2.4 Flux controls for wave-soldering equipment 10.2.5 Soldering temperatures |
| 101 | 10.2.6 Soldering of conductors in terminals 10.2.6.1 Soldering of conductors onto terminals except cup terminals 10.2.6.2 Soldering of conductors onto cup terminals |
| 102 | 10.3 Soldering of components, terminals, and wires into PCB through holes 10.3.1 General 10.3.2 Solder fillets for wires and terminations |
| 103 | 10.3.3 Solder fillets for component leads in plated or non-plated through holes |
| 104 | 10.4 Soldering of surface mount components 10.4.1 General |
| 106 | 10.4.2 Rectangular and square end-capped or end-metallized leadless chip |
| 108 | 10.4.3 Cylindrical and square end-capped components with cylindrical or oval body |
| 109 | 10.4.4 Bottom terminated chip components |
| 111 | 10.4.5 L-Shape inwards components |
| 112 | 10.4.6 Leadless component with plane termination 10.4.7 Leaded component with plane termination |
| 114 | 10.4.8 Leadless castellated ceramic chip carrier components |
| 115 | 10.4.9 No lead Quad Flat Pack |
| 117 | 10.4.10 Flat pack and gull-wing leaded components with round, rectangular, ribbon leads |
| 118 | 10.4.11 Components with “J” leads |
| 119 | 10.4.12 Components with ribbon terminals without stress relief |
| 121 | 10.4.13 Stacked modules components with leads protruding vertically from bottom |
| 122 | 10.4.14 Area array devices |
| 124 | 10.5 Rework and repair 10.5.1 Removal of solder on unpopulated PCB 10.5.2 Rework, repair and modifications |
| 125 | 10.6 High-voltage connections |
| 127 | 10.7 Solderless components |
| 128 | 11 Post soldering process requirements 11.1 Cleaning of PCB assemblies 11.1.1 General |
| 129 | 11.1.2 Verification of cleanliness 11.1.3 Surface Insulation Resistance (SIR) testing |
| 130 | 11.1.4 Sodium chloride (NaCl) equivalent ionic contaminants testing |
| 131 | 11.1.5 Monitoring of cleanliness 11.2 Staking and bonding |
| 132 | 11.3 Conformal coating, potting and underfill |
| 134 | 12 Final inspection 12.1 General 12.2 Visual acceptance criteria |
| 135 | 12.3 Visual rejection criteria |
| 137 | 12.4 X-ray rejection criteria |
| 138 | 12.5 Warp and twist of populated boards 12.6 Inspection records |
| 139 | 13 Verification procedure 13.1 Verification approval procedure 13.1.1 Request for verification 13.1.2 Technology sample 13.1.2.1 Description of technology sample 13.1.2.2 Evaluation of technology sample |
| 140 | 13.1.3 Audit of assembly processing 13.1.4 Verification programme documentation |
| 141 | 13.1.5 Verification samples and testing |
| 142 | 13.1.6 Final verification review 13.1.7 Approval status of assembly line |
| 143 | 13.1.8 Withdrawal of approval status 13.2 Verification programme 13.2.1 General |
| 149 | 13.2.2 Verification for PTH manual soldering 13.2.3 Additional verification for wave soldering 13.2.4 Soldering log |
| 151 | 13.3 Special verification testing for ceramic area array components 13.3.1 General |
| 153 | 13.3.2 Evaluation of AAD capability samples 13.3.3 Electrical verification of AAD assembly |
| 154 | 13.4 Assembly verification with electrical testing procedure |
| 157 | 13.5 Verification programme with reduced temperature range |
| 158 | 13.6 Verification for solderless process |
| 160 | 13.7 Conditions for delta verification |
| 162 | 13.8 Verification by similarity 13.8.1 General conditions for similarity 13.8.2 Conditions for similarity for PTH components |
| 163 | 13.8.3 Conditions for similarity for SMD |
| 166 | 13.8.4 Conditions for similarity for solderless components |
| 167 | 14 Environmental tests conditions 14.1 Overview 14.2 Visual inspection 14.3 X-ray inspection 14.4 Cleanliness test 14.5 Warp and twist of PCB |
| 168 | 14.6 Electrical continuity measurement 14.7 Electrical continuity for wave soldered multilayers PCB |
| 169 | 14.8 Vibration |
| 171 | 14.9 Mechanical shock |
| 173 | 14.10 Damp heat test 14.11 Temperature cycling test |
| 174 | 14.12 Temperature cycling test with reduced temperature range |
| 176 | 14.13 Life test 14.14 Final visual inspection |
| 177 | 14.15 Microsection 14.15.1 Microsection facilities 14.15.2 Microsections location |
| 178 | 14.15.3 Microsection acceptance criteria 14.15.3.1 General 14.15.3.2 Acceptance criteria |
| 191 | 14.15.4 Microsection acceptance criteria for ceramic chip capacitors |
| 198 | 14.16 Anomalies in PCB and sculptured flex during verification |
| 199 | 15 Outsourcing 15.1 General |
| 201 | 16 Process identification document (PID) 16.1 Overview 16.2 Document preparation 16.3 Approval 16.4 Contact person 16.5 Process identification document update |
| 202 | 17 Quality assurance 17.1 General 17.2 Data 17.3 Nonconformance 17.4 Calibration |
| 203 | 17.5 Traceability 17.6 Workmanship standards 17.7 Inspection points 17.8 Operators, inspectors and instructors training and certification |
