ASTM-D5109:2012 Edition

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D5109-12 Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

Published By	Publication Date	Number of Pages
ASTM	2012	9

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Categories: 83.140.20 - Laminated sheets, ASTM

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Description

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1 , 8.1 , and 11.3.1 .

Additional information

Solder Float Test	8
Solvent Resistance	7
Flammability Rating Test	16
Permittivity	14
Flexural Strength, Flatwise at Elevated Temperature	15
Warp or Twist	6
Peel Strength Test at Elevated Temperature	10
Conditioning	4
Flexural Strength, Flatwise at Room Temperature	15
Procedure	Section
Purity of Copper	5
Thickness & Thickness Variation	18
Volume Resistivity	11
Dissipation Factor	14
Dielectric Breakdown Voltage Parallel to Laminations	13
Water Absorption	12
Scratches in Copper Surface	21
Pin Holes in Copper Surface	20
Referenced Documents	2
Surface Resistivity	11
Oven Blister Test	17
Terminology	3
Peel Strength Test at Room Temperature	9
Dimensional Instability	19
ICS Codes	83.140.20 - Laminated sheets

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ASTM-D5109:2012 Edition

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