ASTM-F1238:2003 Edition

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F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

Published By	Publication Date	Number of Pages
ASTM	2003

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Description

ASTM F1238-95-Reapproved2003

Historical Standard: Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications

ASTM F1238

Scope

1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.

1.2 The values stated in SI units are regarded as standard.

Keywords

density; microelectronics; molybdenum; disilicide; refractory silicides; sputtering; sputtering targets; tantalum disilicide; titanium disilicide; tungsten disilicide

ICS Code

ICS Number Code 31.100 (Electronic tubes)

DOI: 10.1520/F1238-95R03

PDF Catalog

PDF Pages	PDF Title
1	Scope Terminology Ordering Information Chemical Composition Physical Properties
2	Dimensions Workmanship, Finish, and Appearance Sampling Analytical Methods Certification Product Marking Packaging Keywords TABLE 1 TABLE 2

Additional information

Standard Title	F1238-95(2003) Standard Specification for Refractory Silicide Sputtering Targets for Microelectronic Applications
Published Code	ASTM
Publication Date	2003