ASTM-F508 1997

$35.75

F508-77(1997)e1 Standard Practice for Specifying Thick-Film Pastes

Published By	Publication Date	Number of Pages
ASTM	1997	3

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Category: ASTM

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Description

ASTM F508-77-e1-Reapproved1997

Historical Standard: Standard Practice for Specifying Thick-Film Pastes

ASTM F508

Scope

1.1 This practice covers the writing of specifications for thick-film pastes for electronics.

1.2 The practice provides a guide for the routine procedure to be followed in specifying for procurement thick-film pastes for use in manufactured circuits. Specific requirements, intended applications, and test methods should be included or identified in each paste specification. In addition, each specification should include basic information to facilitate procurement, preparation, quality control, lot shipment identifications, and shipping of such pastes.

1.3 The practice covers the development of specifications for fireable, thick-film pastes, including resistor, conductor, dielectric, and overglaze pastes.

Keywords

hybrid microcircuits; reliability; solderability; thick films

ICS Code

ICS Number Code n/a

DOI: 10.1520/F0508-77R97E01

Additional information