ASTM-F542 2007

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F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation

Published By	Publication Date	Number of Pages
ASTM	2007	3

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Category: ASTM

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Description

1.1 This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached.

1.2 This test method provides a means to measure the peak exothermic temperature of an encapsulating compound.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8.

Note 1

There is no equivalent IEC standard.

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PDF Pages	PDF Title
1	Scope Referenced Documents Terminology Summary of Test Method Significance and Use Interferences
2	Apparatus Safety Precautions Sampling Conditioning Procedure FIG. 1
3	Report Precision and Bias Keywords

Additional information

Standard Title	F542-07 Standard Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
Published Code	ASTM
Publication Date	2007
Pages Count	3

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ASTM-F542 2007

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