ASTM-F638 2001
$35.75
F638-88(2001) Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
| Published By | Publication Date | Number of Pages |
| ASTM | 2001 | 3 |
ASTM F638-88-Reapproved2001
Withdrawn Standard: Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
ASTM F638
Scope
1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.
1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.
Keywords
magnesium aluminum wire; wire bonding
ICS Code
ICS Number Code 29.060.10 (Wires)
DOI: 10.1520/F0638-88R01
