BS EN 60191-6-19:2010

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Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Published By	Publication Date	Number of Pages
BSI	2010	18

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

Additional information

Status	Definitive
Pages	18
Publication Date	2010-06-30
ISBN	978 0 580 60758 5
Standard Number	BS EN 60191-6-19:2010
Title	Mechanical standardization of semiconductor devices – Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Identical National Standard Of	IEC 60191-6-19:2010, IEC PAS 60191-6-19:2008, EN 60191-6-19:2010
Descriptors	Standardization, Electronic equipment and components, Thermal testing, Concave, Heating tests, Surface mounting devices, Semiconductor devices, Convex, Curved, Integrated circuits, Dimensional measurement, Dimensions, Technical data sheets
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60191-6-19:2010

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BS EN 60191-6-19:2010

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