🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BS EN 60191-6-20:2010

BS EN 60191-6-20:2010

$102.76

Mechanical standardization of semiconductor devices – General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Published By Publication Date Number of Pages
BSI 2010 16
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This part of IEC 60191 specifies methods to measure package dimensions of small outline Jlead-packages (SOJ), package outline form E in accordance with IEC 60191-4.

PDF Catalog

PDF Pages PDF Title
6 1 Scope
2 Normative references
3 Terms and definitions
4 Measuring methods
7 Figures
Figure 1 – SOJ outline drawings
8 Figure 2 – Mounting height
Figure 3 – Stand-off
9 Figure 4 – Body thickness A2
Figure 5 – Lead width and thickness
10 Figure 6 – Measuring points of lead width and thickness
Figure 7 – Soldered portion length Lp
11 Figure 8 – The allowable value t of Lp center
12 Figure 9 – Positional tolerance of terminal
13 Figure 10 – Positional tolerance of terminals

Related products

BS EN 60191-6-20:2010
$102.76