BS EN 60286-4:2013
$102.76
Packaging of components for automatic handling – Stick magazines for electronic components encapsulated in packages of different forms
| Published By | Publication Date | Number of Pages |
| BSI | 2013 | 20 |
IEC 60286-4:2013 is applicable to stick magazines (including end stoppers) intended to be used for storage of electronic components, for transport from the manufacturer to the customer and for in-house use in the manufacturing plant. They are also used to feed automatic placement machines for surface mounting as well as for through-hole mounting of electronic components. This edition includes the following significant technical changes with respect to the previous edition: Clause 4 describes the guidelines for customer specific stick magazine design. It replaces the magazine design rules for IEC outlined components and rules for orientation of components in stick magazines which have been moved to Annexes A to D.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 7 | 1 Scope 2 Normative references 3 Terms, definitions and conventions 3.1 Terms and definitions 3.2 Conventions |
| 8 | 4 Shape and cross-section of stick magazine Figures Figure 1 – Shape and cross-sections of stick magazines |
| 9 | 5 Dimensions of stick magazines 5.1 General Figure 2 – Schematic of stick magazine design and schematic of package profile Tables Table 1 – Tolerances to the package profile dimensions |
| 10 | 5.2 Materials 5.3 Recycling 6 Mechanical stability Table 2 – Principle of stick magazine requirements Table 3 – Material reference for magazines and stoppers |
| 11 | 7 End stoppers and spacers 8 Orientation of the components in the stick magazine 9 Marking |
| 12 | Annex A (informative) DIL packages for through-hole mount Figure A.1 – DIL packages for through-hole mounting Table A.1 – e1 = 3 modules e |
| 13 | Table A.2 – e1 = 4 modules e Table A.3 – e1 = 6 modules e |
| 14 | Annex B (informative) SO packages for surface mounting Figure B.1 – SO packages for surface mounting Table B.1 – Stick magazine dimensions for SO packages |
| 15 | Annex C (informative) Leaded chip carrier packages (PLCC) for surface mounting Figure C.1 – Leaded chip carrier packages (PLCC) for surface mounting Table C.1 – Stick magazine dimensions for PLCC packages |
| 16 | Annex D (normative) Rule for the orientation of integrated circuit packages in handling and shipping carriers such as stick magazines and rails (from IEC 60191-3:1999, Annex G) |
| 17 | Figure D.1 – Five examples of the terminal No. 1 marking locations |
| 18 | Bibliography |
