BS EN 60384-1:2016
$215.11
Fixed capacitors for use in electronic equipment – Generic specification
Published By | Publication Date | Number of Pages |
BSI | 2016 | 92 |
1.1 Scope
This part of IEC 60384 is a generic specification and is applicable to fixed capacitors for use in electronic equipment.
It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.
1.2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies.
- IEC 60027 (all parts), Letter symbols to be used in electrical technology
- IEC 60050 (all parts), International Electrotechnical Vocabulary 1
- IEC 60062, Marking codes for resistors and capacitors
- IEC 60063, Preferred number series for resistors and capacitors
- IEC 60068‑1:2013, Environmental testing — Part 1: General and guidance
- IEC 60068‑2‑1:2007, Environmental testing — Part 2-1: Tests — Tests A: Cold
- IEC 60068‑2‑2:2007, Environmental testing — Part 2-2: Tests — Tests B: Dry heat
- IEC 60068‑2‑6:2007, Environmental testing — Part 2-6: Tests — Test Fc: Vibration (sinusoidal)
- IEC 60068‑2‑13:1983, Environmental testing — Part 2-13: Tests — Test M: Low air pressure
- IEC 60068‑2‑14:2009, Environmental testing — Part 2-14: Tests — Test N: Change of temperature
- IEC 60068‑2‑17:1994, Environmental testing — Part 2-17: Tests — Test Q: Sealing
- IEC 60068‑2‑20:2008, Environmental testing — Part 2-20: Tests — Test T: Test methods for solderability and resistance to soldering heat of devices with leads
- IEC 60068‑2‑21:2006, Environmental testing — Part 2-21: Tests — Test U: Robustness of terminations and integral mounting devices
- IEC 60068‑2‑27:2008, Environmental testing — Part 2-27: Tests — Test Ea and guidance: Shock
- IEC 60068‑2‑30:2005, Environmental testing — Part 2-30: Tests — Test Db: Damp heat, cyclic (12 h + 12 h cycle)
- IEC 60068‑2‑45:1980, Environmental testing — Part 2-45: Tests — Test XA and guidance: Immersion in cleaning solvents IEC 60068-2-45:1980/AMD1:1993
- IEC 60068‑2‑54:2006, Environmental testing — Part 2-54: Tests — Test Ta: Solderability testing of electronic components by the wetting balance method
- IEC 60068‑2‑58:2015, Environmental testing — Part 2-58: Tests — Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
- IEC 60068‑2‑67:1995, Environmental testing — Part 2-67: Tests — Test Cy: Damp heat, steady state, accelerated test primarily intended for components
- IEC 60068‑2‑69:2007, Environmental testing — Part 2-69: Tests — Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
- IEC 60068‑2‑78:2012, Environmental testing — Part 2-78: Tests — Test Cab: Damp heat, steady state
- IEC 60068‑2‑82:2007, Environmental testing — Part 2-82: Tests — Test XW1: Whisker test methods for electronic and electric components
- IEC 60294, Measurement of the dimensions of a cylindrical component with axial terminations
- IEC 60617, Graphical symbols for diagrams
- IEC 60695‑11‑5:2004, Fire hazard testing — Part 11-5: Test flames — Needle-flame test method — Apparatus, confirmatory test arrangement and guidance
- IEC 60717, Method for the determination of the space required by capacitors and resistors with unidirectional terminations
- IEC 61193‑2, Quality assessment systems — Part 2: Selection and use of sampling plans for inspection of electronic components and packages
- IEC 61249‑2‑7:2002, Materials for printed boards and other interconnecting structures — Part 2-7: Reinforced base materials clad and unclad — Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
- ISO 3, Preferred numbers — Series of preferred numbers
- ISO 80000‑1, Quantities and units — Part 1: General
PDF Catalog
PDF Pages | PDF Title |
---|---|
4 | European foreword Endorsement notice |
7 | English CONTENTS |
14 | FOREWORD |
16 | INTRODUCTION |
18 | 1 General 1.1 Scope 1.2 Normative references |
20 | 2 Technical data 2.1 Symbols, units and abbreviated terms 2.1.1 General 2.1.2 Letter symbols |
21 | 2.1.3 Abbreviations 2.2 Terms and definitions |
26 | 2.3 Preferred values and additional technical requirements 2.3.1 General 2.3.2 Preferred values of nominal capacitance 2.3.3 Preferred values of rated voltage 2.3.4 Rated a.c. load |
27 | 2.3.5 Rated pulse load 2.3.6 Temperature derated voltage Figures Figure 1 – Reactive power against frequency |
28 | 2.4 Marking 2.4.1 General 2.4.2 Coding 3 Quality assessment procedures Figure 2 – Relation between category temperature range and applied voltage |
29 | 4 Tests and measurement procedures |
30 | 4.1 General 4.2 Standard atmospheric conditions 4.2.1 Standard atmospheric conditions for testing 4.2.2 Recovery conditions |
31 | 4.2.3 Referee conditions 4.2.4 Reference conditions 4.3 Drying 4.4 Visual examination and check of dimensions 4.4.1 Visual examination 4.4.2 Dimensions (gauging) 4.4.3 Dimensions (detail) Tables Table 1 – Referee conditions |
32 | 4.5 Insulation resistance 4.5.1 Preconditioning 4.5.2 Measuring conditions 4.5.3 Test points 4.5.4 Test methods Table 2 – Measurement of insulation resistance |
33 | 4.5.5 Temperature compensation 4.5.6 Conditions to be prescribed in the relevant specification |
34 | 4.6 Voltage proof 4.6.1 General 4.6.2 Test circuit (for the test between terminations) Table 3 – Measuring points |
35 | 4.6.3 Test Figure 3 – Voltage-proof test circuit |
37 | 4.6.4 Requirements 4.6.5 Conditions to be prescribed in the relevant specification 4.7 Capacitance 4.7.1 Measuring frequency and measuring voltage |
38 | 4.7.2 Measuring equipment 4.7.3 Conditions to be prescribed in the relevant specification 4.8 Tangent of loss angle and equivalent series resistance (ESR) 4.8.1 Tangent of loss angle 4.8.2 Equivalent series resistance (ESR) |
39 | 4.9 Leakage current 4.9.1 Preconditioning 4.9.2 Test method 4.9.3 Power source 4.9.4 Measuring accuracy 4.9.5 Test circuit 4.9.6 Conditions to be prescribed in the relevant specification 4.10 Impedance |
40 | 4.11 Selfresonant frequency and inductance 4.11.1 Self-resonant frequency (fr) Figure 4 – Schematic diagram of the impedance measuring circuit |
41 | Figure 5 – Capacitor mounting arrangement |
42 | Figure 6 – Capacitor mounting arrangement Figure 7 – Typical diagram of an absorption oscillator-wavemeter |
43 | 4.11.2 Inductance 4.11.3 Conditions to be prescribed in the relevant specification 4.12 Outer foil termination Figure 8 – Schematic diagram of the measuring circuit |
44 | 4.13 Robustness of terminations 4.13.1 General 4.13.2 Test Ua1 – Tensile Figure 9 – Test circuit |
45 | 4.13.3 Test Ub – Bending (half of the sample) 4.13.4 Test Uc – Torsion (remaining sample) 4.13.5 Test Ud – Torque 4.13.6 Visual examination Table 4 – Tensile force Table 5 – Torque |
46 | 4.14 Resistance to soldering heat 4.14.1 Preconditioning and initial measurement 4.14.2 Test procedure 4.14.3 Recovery 4.14.4 Final inspection, measurement and requirements 4.15 Solderability 4.15.1 General 4.15.2 Preconditioning |
47 | 4.15.3 Test procedure 4.15.4 Final inspection, measurements and requirements 4.16 Rapid change of temperature 4.16.1 Initial measurement 4.16.2 Test procedure 4.16.3 Final inspection, measurements and requirements 4.17 Vibration 4.17.1 Initial measurement |
48 | 4.17.2 Test procedure 4.17.3 Electrical test (intermediate measurement) 4.17.4 Final inspection, measurements and requirements 4.18 Bump (repetitive shock) 4.18.1 Initial measurement 4.18.2 Test procedure 4.18.3 Final inspection, measurements and requirements 4.19 Shock 4.19.1 Initial measurement 4.19.2 Test procedure |
49 | 4.19.3 Final inspection, measurements and requirements 4.20 Container sealing 4.21 Climatic sequence 4.21.1 General 4.21.2 Initial measurements 4.21.3 Dry heat 4.21.4 Damp heat, cyclic, Test Db, first cycle 4.21.5 Cold |
50 | 4.21.6 Low air pressure 4.21.7 Damp heat, cyclic, Test Db, remaining cycles 4.21.8 Final measurements 4.22 Damp heat, steady state 4.22.1 Initial measurement 4.22.2 Test procedure Table 6 – Number of cycles |
51 | 4.22.3 Final inspection, measurements and requirements 4.23 Endurance 4.23.1 Initial measurements 4.23.2 Test procedure 4.23.3 Conditions to be prescribed in the relevant specification 4.23.4 Test voltage |
52 | 4.23.5 Placement in the test chamber 4.23.6 Recovery 4.23.7 Final inspection, measurements and requirements Figure 10 – Test circuit for electrolytic capacitors |
53 | 4.24 Variation of capacitance with temperature 4.24.1 Static method 4.24.2 Dynamic method |
54 | 4.24.3 Methods of calculation |
55 | 4.25 Storage 4.25.1 Storage at high temperature 4.25.2 Storage at low temperature |
56 | 4.26 Surge 4.26.1 Initial measurement 4.26.2 Test procedure Figure 11 – Relay circuit Figure 12 – Thyristor circuit |
57 | 4.26.3 Final inspection, measurements and requirements 4.26.4 Information to be given in the relevant detail specification 4.27 Charge and discharge tests and inrush current test 4.27.1 Initial measurement 4.27.2 Test procedure Figure 13 – Voltage waveform across capacitor |
58 | 4.27.3 Charge and discharge Figure 14 – Voltage and current waveform |
59 | 4.27.4 Inrush current 4.27.5 Final inspection, measurements and requirements 4.28 Pressure relief (for aluminium electrolytic capacitors) 4.28.1 General 4.28.2 AC test 4.28.3 DC test 4.28.4 Pneumatic test 4.28.5 Final inspection, measurements and requirements 4.29 Characteristics at high and low temperature 4.29.1 Test procedure |
60 | 4.29.2 Requirements 4.30 Thermal stability test 4.31 Component solvent resistance 4.31.1 Initial measurements 4.31.2 Test procedure 4.31.3 Final inspection, measurements and requirements 4.32 Solvent resistance of marking 4.32.1 Test procedure |
61 | 4.32.2 Final inspection, measurements and requirements 4.33 Mounting (for surface mount capacitors only) 4.33.1 Substrate 4.33.2 Wave soldering 4.33.3 Reflow soldering |
63 | Figure 15 – Suitable substrate for mechanical tests |
64 | 4.34 Shear test 4.34.1 Test procedure 4.34.2 Final inspection, measurements and requirements 4.35 Substrate bending test 4.35.1 Test procedure Figure 16 – Suitable substrate for electrical tests |
65 | 4.35.2 Recovery 4.35.3 Final inspection and requirements 4.36 Dielectric absorption 4.36.1 Test procedure |
66 | 4.36.2 Requirement 4.37 Damp heat, steady state, accelerated 4.37.1 Initial measurements 4.37.2 Test methods 4.37.3 Test procedures 4.37.4 Final inspection, measurements and requirements 4.38 Passive flammability 4.38.1 Test procedure |
67 | 4.38.2 Final inspection, measurements and requirements 4.39 High surge current test 4.39.1 Initial measurements 4.39.2 Test procedure Table 7 – Severities and requirements |
68 | 4.39.3 Requirements for the charging circuit 4.39.4 Nonconforming items 4.40 Voltage transient overload (for aluminium electrolytic capacitors with non-solid electrolyte) 4.40.1 Initial measurement 4.40.2 Test procedure Figure 17 – High surge current test |
69 | Figure 18 – Voltage transient overload test circuit |
70 | 4.40.3 Final inspection, measurements and requirements 4.40.4 Conditions to be prescribed in the relevant specification 4.41 Whisker growth test 4.41.1 General Figure 19 – Voltage waveform |
71 | 4.41.2 Preparation of specimen 4.41.3 Initial measurement 4.41.4 Test procedures 4.41.5 Test severities 4.41.6 Final inspection, measurements and requirements |
72 | Annexes Annex A (informative) Interpretation of sampling plans and procedures as described in IEC 60410 for use within quality assessment systems |
73 | Annex B (informative) Rules for the preparation of detail specifications for capacitors and resistors for electronic equipment for use within quality assessment systems B.1 Drafting B.2 Reference standard B.3 Circulation |
74 | Annex C (informative) Layout of the first page of a PCP/CQC specification |
75 | Annex D (informative) Requirements for capability approval test report D.1 General D.2 Requirements D.3 Summary of test information (for each CQC) D.4 Measurement record |
76 | Annex E (informative) Guide for pulse testing of capacitors E.1 Overview E.2 Typical capacitor pulse conditions |
77 | E.3 Effect of inductance on pulse testing |
79 | Annex F (informative) Guidance for the extension of endurance tests on fixed capacitors F.1 Overview F.2 Guidelines |
80 | Annex G (normative) Damp heat, steady state with voltage applied, for metallized film capacitors only G.1 Overview G.2 Test procedure |
81 | Annex H (normative) Accelerated damp heat, steady state, for multilayer ceramic capacitors only H.1 Mounting of capacitors H.2 Initial measurement H.3 Test procedure H.4 Recovery H.5 Final inspection, measurements and requirements |
82 | Annex Q (informative) Quality assessment procedures Q.1 General Q.1.1 Scope of this annex |
83 | Q.1.2 Quality assessment definitions Q.1.3 Rework |
84 | Q.1.4 Alternative test methods Q.1.5 Certified test records of released lots Q.1.6 Unchecked parameters Q.1.7 Delayed delivery Q.1.8 Repair |
85 | Q.1.9 Registration of approvals Q.1.10 Manufacture outside the geographical limits Q.2 Qualification approval (QA) procedures Q.2.1 Eligibility for qualification approval Q.2.2 Application for qualification approval Q.2.3 Subcontracting Q.2.4 Test procedure for the initial product qualification approval Q.2.5 Granting of qualification approval |
86 | Q.2.6 Maintenance of qualification approval Q.2.7 Quality conformance inspection Q.3 Capability approval (CA) procedures Q.3.1 General Q.3.2 Eligibility for capability approval |
87 | Q.3.3 Application for capability approval Q.3.4 Subcontracting Q.3.5 Description of the capability Q.3.6 Demonstration and verification of capability Q.3.7 Granting of capability approval Q.3.8 Maintenance of capability approval Q.3.9 Quality conformance inspection |
88 | Q.4 Technology approval (TA) procedure Q.4.1 General Q.4.2 Eligibility for technology approval Q.4.3 Application of technology approval Q.4.4 Subcontracting Q.4.5 Description of technology Q.4.6 Demonstration and verification of the technology |
89 | Q.4.7 Granting of technology approval Q.4.8 Maintenance of technology approval Q.4.9 Quality conformance inspection |
90 | Bibliography |