BS EN 60384-2:2012
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Fixed capacitors for use in electronic equipment – Sectional specification. Fixed metallized polyethylene terephthalate film dielectric d.c. capacitors
Published By | Publication Date | Number of Pages |
BSI | 2012 | 32 |
IEC 60384-2:2011 applies to fixed capacitors for direct current, with metallized electrodes and polyethylene-terephthalate dielectric for use in electronic equipment. These capacitors may have “self-healing properties” depending on conditions of use. They are primarily intended for applications where the a.c. component is small with respect to the rated voltage. Two performance grades of capacitors are covered, Grade 1 for long-life application and Grade 2 for general application. Capacitors for electromagnetic interference suppression and surface mount fixed metallized polyethylene-terephthalate film dielectric d.c. capacitors are not included, but are covered by IEC 60384-14 and IEC 60384-19 respectively. This fourth edition cancels and replaces the third edition published in 2005 and contains the following significant technical changes with respect to the previous edition. – Table 1, Sampling plan together with numbers of permissible non-conformance for qualification approval test, has been adjusted. – Table 3, Lot-by-lot inspection, has been changed, highlighting assessment level EZ only. – Table 4, Periodic inspection, has been changed, highlighting assessment level EZ only. – The preferred values of rated voltages have been updated in conformance with the basic series of preferred values R5 and R10 given in ISO 3.
PDF Catalog
PDF Pages | PDF Title |
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6 | English CONTENTS |
8 | 1 General 1.1 Scope 1.2 Object 1.3 Normative references 1.4 Information to be given in a detail specification |
9 | 1.5 Terms and definitions |
10 | 1.6 Marking |
11 | 2 Preferred ratings and characteristics 2.1 Preferred characteristics 2.2 Preferred values of ratings |
12 | 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Certified records of released lots 3.4 Qualification approval |
14 | Tables Table 1 – Sampling plan together with numbers of permissiblenon-conformance for qualification approval test |
15 | Table 2 – Test schedule for qualification approval |
19 | 3.5 Quality conformance inspection |
20 | Table 3 – Lot-by-lot inspection |
21 | 4 Test and measurement procedures 4.1 Visual examination and check of dimensions 4.2 Electrical tests Table 4 – Periodic inspection Table 5 – Test points and voltages |
22 | Table 6 – Tangent of loss angle requirements |
23 | Table 7 – Insulation resistance requirements |
24 | 4.3 Robustness of terminations 4.4 Resistance to soldering heat 4.5 Solderability Table 8 – Correction factors |
25 | 4.6 Rapid change of the temperature 4.7 Vibration 4.8 Bump |
26 | 4.9 Shock 4.10 Climatic sequence Table 9 – Preferred severities |
27 | 4.11 Damp heat, steady state |
28 | 4.12 Endurance 4.13 Charge and discharge Table 10 – Test conditions |
29 | 4.14 Component solvent resistance 4.15 Solvent resistance of the marking Table 11 – Lead spacing |
30 | Bibliography |