BS EN 60384-22:2012
$189.07
Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 48 |
IEC 60384-22:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification should be of equal or higher performance level, lower performance levels are not permitted. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition. – The measuring frequency of 1 MHz has been reduced to 1 kHz for 100 pF, see 4.5.1 Capacitance. – The test voltage of 1,2 U R at U R greater or equal to 1 000 V has been added in 4.5.4 Voltage proof. – Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. – Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. – A selection of the test conditions according to marketing needs has been stated in 4.13 Damp heat, steady state. – The dimensions of 0402 M in Annex A have been added. – The temperature characteristics code of capacitance for the reference temperature of 25 °C has been added, see Annex C.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 10 | 1 General 1.1 Scope 1.2 Object 1.3 Normative references 1.4 Information to be given in a detail specification |
| 12 | 1.5 Terms and definitions 1.6 Marking |
| 13 | 2 Preferred rating and characteristics 2.1 Preferred characteristics |
| 14 | 2.2 Preferred values of ratings Tables Table 1 – Preferred values of category voltages |
| 15 | Table 2 – Preferred tolerances Table 3 – Temperature characteristic of capacitance |
| 16 | 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Certified records of released lots 3.4 Qualification approval |
| 18 | Table 4 – Fixed sample size test plan for qualification approval, assessment level EZ |
| 19 | Table 5 – Tests schedule for qualification approval |
| 22 | 3.5 Quality conformance inspection |
| 23 | Table 6a – Lot-by-lot inspection Table 6b – Periodic test |
| 24 | 4 Test and measurement procedures 4.1 Special preconditioning 4.2 Measuring conditions 4.3 Mounting 4.4 Visual examination and check of dimensions |
| 25 | Figures Figure 1 – Fault: crack or fissure Figure 2 – Fault: crack or fissure Figure 3 – Separation or delamination Figure 4 – Exposed electrodes |
| 26 | 4.5 Electrical tests Figure 5 – Principal faces Table 7 – Measuring conditions |
| 27 | Table 8 – Tangent of loss angle limits |
| 28 | Table 9 – Test voltages |
| 29 | 4.6 Temperature characteristic of capacitance Table 10 – Details of measuring conditions |
| 30 | 4.7 Shear test 4.8 Substrate bending test |
| 31 | 4.9 Resistance to soldering heat |
| 32 | Figure 6 – Reflow temperature profile Table 11 – Reflow temperature profiles for Sn-Ag-Cu alloy |
| 33 | 4.10 Solderability Table 12 – Maximum capacitance change |
| 34 | 4.11 Rapid change of temperature |
| 35 | 4.12 Climatic sequence Table 13 – Maximum capacitance change Table 14 – Number of damp heat cycles |
| 36 | 4.13 Damp heat, steady state Table 15 – Final inspection, measurements and requirements |
| 37 | 4.14 Endurance Table 16 – Test conditions for damp heat, steady state Table 17 – Final inspection, measurements and requirements |
| 38 | Table 18 – Endurance test conditions (UC = UR) Table 19 – Endurance test conditions (UC ≠ UR) |
| 39 | 4.15 Robustness of terminations (only for capacitors with strip termination) 4.16 Component solvent resistance (if required) 4.17 Solvent resistance of the marking (if required) 4.18 Accelerated damp heat, steady state (if required) Table 20 – Final inspection, measurements and requirements of endurance test |
| 40 | Table 21 – Initial requirements Table 22 – Conditioning |
| 41 | Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 Figure A.1 – Dimensions Table A.1 – Dimensions |
| 42 | Annex B (informative) Capacitance ageing of fixed capacitors of ceramic dielectric, Class 2 |
| 44 | Annex C (informative) Temperature characteristics of capacitance for the reference temperature of 25 °C Table C.1 – Temperature characteristics of capacitance for the reference temperature of 25 °C Table C.2 – Measuring conditions of temperature characteristic of capacitance for the reference temperature of 25 °C |
| 45 | Bibliography |
