BS EN 60749-40:2011
$142.49
Semiconductor devices. Mechanical and climatic test methods – Board level drop test method using a strain gauge
| Published By | Publication Date | Number of Pages |
| BSI | 2011 | 26 |
This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test.
This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component. Test method IEC 60749-37 uses an accelerometer to measure the mechanical shock duration and magnitude applied which is proportional to the stress on a given component mounted on a standard board. The detailed specification shall state which test method is to be used.
NOTE 1 Although this test can evaluate a structure where the mounting method and its conditions, the design of a printed wired board, solder material, the mounting capability of a semiconductor device, etc. are combined, it does not solely evaluate the mounting capability of a semiconductor device.
NOTE 2 The result of this test is strongly influenced by the differences between soldering conditions, the design of the land pattern of a printed wired board, solder material, etc. Therefore, in carrying out this test, it is necessary to recognize that this test cannot intrinsically guarantee the reliability of the solder joint of the semiconductor devices.
NOTE 3 When the mechanical stress which is generated by this test does not occur in the actual application of the device, implementation of this test is unnecessary.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions |
| 9 | 4 Test equipment 5 Test procedure 5.1 Test specimen 5.2 Test substrate 5.3 Solder paste |
| 10 | 5.4 Mounting method 5.5 Pre-conditionings 5.6 Initial measurements 5.7 Intermediate measurement 5.8 Final measurement 6 Test method 6.1 Purpose of test method 6.2 Example of drop test equipment |
| 11 | 6.3 Example of substrate-securing jig 6.4 Example of distance between supporting points 6.5 Example of impacting surface 6.6 Strain gauge 6.7 Strain gauge attachment Figures Figure 1 – Example of drop test equipment and substrate securing jig |
| 12 | 6.8 Strain measurement instrument Figure 2 – Position of strain gauge attachment |
| 13 | 6.9 Test condition Figure 3 – Strain measurement instrument Figure 4 – Waveform of strain and electrical conductivity of daisy chain |
| 15 | Figure 5 – Correlation strain and number of failures and strain and pulse duration |
| 16 | 7 Summary Figure 7 – Correlation between the number of times of failure and the maximum strain Figure 8 – Direction of dropping |
| 18 | Annex A (normative) Drop impact test method using test rod Figure A.1 – Outline of test apparatus |
| 20 | Figure A.2 – Waveform of strain and electrical conductivity of a daisy chain |
| 21 | Annex B (informative) An example of strain gauge attachment procedure Figure B.1 – Equipment and materials |
| 22 | Figure B.2 – Example of Attaching Strain Gauge and Guide Mark Dimensions |
| 23 | Figure B.3 – Strain gauge attachment procedure, part 1 |
| 24 | Figure B.4 – Strain gauge attachment procedure, part 2 |
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BS EN 60749-40:2011
Semiconductor devices. Mechanical and climatic test methods – Board level drop test method using a…
