BS EN 61191-3:2017 – TC:2020 Edition

$186.33

Tracked Changes. Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies

Published By	Publication Date	Number of Pages
BSI	2020	61

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Description

IEC 61191-3:2017(E) prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting). This edition includes the following significant technical changes with respect to the previous edition: a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Additional information

Status	Definitive
Pages	61
Publication Date	2020-02-26
ISBN	978 0 539 10340 3
Standard Number	BS EN 61191-3:2017 – TC
Title	Tracked Changes. Printed board assemblies – Sectional specification. Requirements for through-hole mount soldered assemblies
Descriptors	Printed-circuit boards, Electrical components, Joints, Printed circuits, Soldering, Holes, Wires, Boards, Microassembling, Electrical equipment, Defects, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices
Publisher	BSI
Committee	EPL/501
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BS EN 61191-3:2017 - TC

$186.33


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