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BS EN 62047-15:2015

BS EN 62047-15:2015

$102.76

Semiconductor devices. Micro-electromechanical devices – Test method of bonding strength between PDMS and glass

Published By Publication Date Number of Pages
BSI 2015 18
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This part of IEC 62047 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.

PDF Catalog

PDF Pages PDF Title
6 English
CONTENTS
7 FOREWORD
9 1 Scope
2 Normative references
3 Terms and definitions
10 4 Testing method
4.1 Visual test
4.1.1 General
4.1.2 Equipment
4.1.3 Procedure
4.1.4 Visual test results
4.2 Bonding strength test
4.2.1 General
Tables
Table 1 − Result of visual test
11 4.2.2 Sample preparation
4.2.3 Procedure
Figures
Figure 1 – Blister mask
12 4.2.4 Result of blister test
4.3 Contact angle measurement
4.3.1 General
4.3.2 Equipment
4.3.3 Procedure
Figure 2 – PDMS blister
13 4.3.4 Result of test
4.4 Hermeticity test
4.4.1 General
4.4.2 Equipment
Figure 3 – Contact angle measurement of water drop on PDMS
14 4.4.3 Procedure
4.4.4 Result of test
Figure 4 – Test set-up for hermeticity
15 Bibliography

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BS EN 62047-15:2015
$102.76