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BS EN 62047-8:2011

BS EN 62047-8:2011

$102.76

Semiconductor devices. Micro-electromechanical devices – Strip bending test method for tensile property measurement of thin films

Published By Publication Date Number of Pages
BSI 2011 22
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IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.

PDF Catalog

PDF Pages PDF Title
5 English

CONTENTS
6 1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
4.1 General
7 4.2 Actuator
4.3 Load tip
4.4 Alignment mechanism
4.5 Force and displacement sensors
4.6 Test environment
5 Test piece
5.1 General
8 5.2 Shape of test piece
5.3 Measurement of test piece dimension
Figures

Figure 1 ā€“ Thin film test piece
Table 1 ā€“ Symbols and designations of a test piece
9 6 Test procedure and analysis
6.1 General
6.2 Data analysis
10 7 Test report
Figure 2 ā€“ Schematic of strip bending test
11 Annex A (informative) Data analysis: Test results by using nanoindentation apparatus

Figure A.1 ā€“ Three successive indents for determining the reference location of a test piece
12 Figure A.2 ā€“ A schematic view of nanoindentation apparatus
Figure A.3 ā€“ Actuator force vs. deflection curvesfor strip bending test and for leaf spring test
13 Figure A.4 ā€“ Force vs. deflection curve of a test piece
after compensating the stiffness of the leaf spring
14 Annex B (informative)
Test piece fabrication: MEMS process
Figure B.1 ā€“ Fabrication procedure for test piece
16 Annex C (informative)
Effect of misalignment and geometry on property measurement
17 Figure C.1 ā€“ Finite element analysis of errors based on the constitutive dataof Au thin film of 1
um thick
18 Figure C.2 ā€“ Translational (d) and angular (a, b, y
) misalignments
19 Bibliography

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BS EN 62047-8:2011
$102.76