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BS EN 62137-4:2014:2015 Edition

BS EN 62137-4:2014:2015 Edition

$189.07

Electronics assembly technology – Endurance test methods for solder joint of area array type package surface mount devices

Published By Publication Date Number of Pages
BSI 2015 48
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This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.

This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and consumer electrical or electronic equipment.

An acceleration factor for the degradation of the solder joints of the packages by the temperature cycling test due to the thermal stress when mounted, is described Annex A.

Annex H provides some explanations concerning various types of mechanical stress when mounted.

The test method specified in this standard is not intended to evaluate semiconductor devices themselves.

NOTE 1 Mounting conditions, printed wiring boards, soldering materials, and so on, significantly affect the result of the test specified in this standard. Therefore, the test specified in this standard is not regarded as the one to be used to guarantee the mounting reliability of the packages.

NOTE 2 The test method is not necessary, if there is no stress (mechanical or other) to solder joints in field use and handling after mounting.

PDF Catalog

PDF Pages PDF Title
7 English
CONTENTS
11 1 Scope
2 Normative references
12 3 Terms definitions and abbreviations
3.1 Terms and definitions
3.2 Abbreviations
4 General
13 5 Test apparatus and materials
5.1 Specimen
5.2 Reflow soldering equipment
5.3 Temperature cycling chamber
5.4 Electrical resistance recorder
5.5 Test substrate
Figures
Figure 1 – Region for evaluation of the endurance test
14 5.6 Solder paste
6 Specimen preparation
15 Figure 2 – Typical reflow soldering profile for Sn63Pb37 solder alloy
16 7 Temperature cycling test
7.1 Pre-conditioning
7.2 Initial measurement
7.3 Test procedure
Figure 3 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy
17 Figure 4 – Test conditions of temperature cycling test
Tables
Table 1 – Test conditions of temperature cycling test
18 7.4 End of test criteria
7.5 Recovery
7.6 Final measurement
8 Temperature cycling life
9 Items to be specified in the relevant product specification
20 Annex A (informative) Acceleration of the temperature cycling test for solder joints
A.1 General
A.2 Acceleration of the temperature cycling test for an Sn-Pb solder joint
21 A.3 Temperature cycling life prediction method for an Sn-Ag-Cu solder joint
Table A.1 – Example of test results of the acceleration factor (Sn63Pb37 solder alloy)
23 Figure A.1 – FBGA package device and FEA model for calculation of acceleration factors AF
Table A.2 – Example test results of the acceleration factor (Sn96,5Ag3Cu,5 solder alloy)
24 Figure A.2 – Example of acceleration factors AF with an FBGA package device using Sn96,5Ag3Cu,5 solder alloy
Table A.3 – Material constant and inelastic strain range calculated by FEA for FBGA package devices as shown in Figure A.1 (Sn96,5Ag3Cu,5 solder alloy)
25 A.4 Factor that affects the temperature cycling life of the solder joint
Figure A.3 – Fatigue characteristics of Sn96,5Ag3Cu,5 an alloy micro solder joint (Nf = 20 % load drop from initial load)
26 Annex B (informative) Electrical continuity test for solder joints of the package
B.1 General
B.2 Package and daisy chain circuit
B.3 Mounting condition and materials
B.4 Test method
B.5 Temperature cycling test using the continuous electric resistance monitoring system
Figure B.1 – Example of a test circuit for the electrical continuity test of a solder joint
27 Figure B.2 – Measurement example of continuously monitored resistance in the temperature cycling test
28 Annex C (informative) Reflow solderability test method for package and test substrate land
C.1 General
C.2 Test equipment
C.2.1 Test substrate
C.2.2 Pre-conditioning oven
C.2.3 Solder paste
C.2.4 Metal mask for screen printing
C.2.5 Screen printing equipment
C.2.6 Package mounting equipment
C.2.7 Reflow soldering equipment
29 C.2.8 X-ray inspection equipment
C.3 Standard mounting process
C.3.1 Initial measurement
C.3.2 Pre-conditioning
C.3.3 Package mounting on test substrate
Figure C.1 – Temperature measurement of specimen using thermocouples
30 C.3.4 Recovery
C.3.5 Final measurement
C.4 Examples of faulty soldering of area array type packages
C.4.1 Repelled solder by contamination on the ball surface of the BGA package
C.4.2 Defective solder ball wetting caused by a crack in the package
Figure C.2 – Repelled solder caused by contamination on the solder ball surface
31 C.5 Items to be given in the product specification
Figure C.3 – Defective soldering as a result of a solder ball drop
32 Annex D (informative) Test substrate design guideline
D.1 General
D.2 Design standard
D.2.1 General
D.2.2 Classification of substrate specifications
33 Table D.1 – Types classification of the test substrate
34 D.2.3 Material of the test substrate
D.2.4 Configuration of layers of the test substrate
D.2.5 Land shape of test substrate
D.2.6 Land dimensions of the test substrate
Figure D.1 – Standard land shapes of the test substrate
Table D.2 – Standard layers’ configuration of test substrates
35 D.3 Items to be given in the product specification
36 Annex E (informative) Heat resistance to reflow soldering for test substrate
E.1 General
E.2 Test apparatus
E.2.1 Pre-conditioning oven
E.2.2 Reflow soldering equipment
E.3 Test procedure
E.3.1 General
E.3.2 Pre-conditioning
E.3.3 Initial measurement
37 E.3.4 Moistening process (1)
E.3.5 Reflow heating (1)
E.3.6 Moistening process (2)
E.3.7 Reflow heating process (2)
E.3.8 Final measurement
E.4 Items to be given in the product specification
38 Annex F (informative) Pull strength measurement method for the test substrate land
F.1 General
F.2 Test apparatus and materials
F.2.1 Pull strength measuring equipment
F.2.2 Reflow soldering equipment
F.2.3 Test substrate
F.2.4 Solder ball
F.2.5 Solder paste
F.2.6 Flux
39 F.3 Measurement procedure
F.3.1 Pre-conditioning
F.3.2 Solder paste printing
F.3.3 Solder ball placement
F.3.4 Reflow heating process
F.3.5 Pull strength measurement
Figure F.1 – Measuring methods for pull strength
40 F.3.6 Final measurement
F.4 Items to be given in the product specification
41 Annex G (informative) Standard mounting process for the packages
G.1 General
G.2 Test apparatus and materials
G.2.1 Test substrate
G.2.2 Solder paste
G.2.3 Metal mask for screen printing
G.2.4 Screen printing equipment
G.2.5 Package mounting equipment
G.2.6 Reflow soldering equipment
Table G.1 – Stencil design standard for packages
42 G.3 Standard mounting process
G.3.1 Initial measurement
G.3.2 Solder paste printing
G.3.3 Package mounting
G.3.4 Reflow heating process
Figure G.1 – Example of printed conditions of solder paste
43 G.3.5 Recovery
G.3.6 Final measurement
G.4 Items to be given in the product specification
Figure G.2 – Temperature measurement of the specimen using thermocouples
44 Annex H (informative) Mechanical stresses to the packages
H.1 General
H.2 Mechanical stresses
Table H.1 – Mechanical stresses to mounted area array type packages
45 Bibliography

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BS EN 62137-4:2014
$189.07