BS EN 62415:2010
$86.31
Semiconductor devices. Constant current electromigration test
| Published By | Publication Date | Number of Pages |
| BSI | 2010 | 14 |
This standard describes a method for conventional constant current electromigration testing of metal lines, via string and contacts.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 5 | English CONTENTS |
| 6 | 1 Scope 2 Symbols, terms and definitions 2.1 Symbols 2.2 Terms and definitions |
| 7 | 3 Background 4 Sample size 5 Test structures 5.1 Lines Figures Figure 1 – TEG of electromigration evaluation for metal line |
| 8 | 5.2 Via chains 5.3 Contact chains 6 Test conditions Figure 2 – TEG of electromigration evaluation for vias |
| 9 | 7 Failure criteria 8 Data analysis Figure 3 – Graph fitted lognormal distribution |
| 10 | Figure 4 – Estimate procedure of current density exponent |
| 11 | Figure 5 – Estimation procedure of activation energy |
| 12 | Bibliography |
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BS EN 62415:2010
Semiconductor devices. Constant current electromigration test Published By Publication Date Number of Pages BSI 2010…
