BS EN 62435-5:2017
$142.49
Electronic components. Long-term storage of electronic semiconductor devices – Die and wafer devices
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 26 |
This part of IEC 62435, is applicable to long-term storage of die and wafer devices and establishes specific storage regimen and conditions for singulated bare die and partial or complete wafers of die including die with added structures such as redistribution layers and solder balls or bumps or other metallisation. This part also provides guidelines for special requirements and primary packaging that contain the die or wafers for handling purposes. Typically, this part is used in conjunction with IEC 62435-1 for long-term storage of devices whose duration can be more than 12 months for products scheduled for long duration storage.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 12 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms 3.1 Terms and definitions |
| 13 | 3.2 Abbreviations 4 Storage requirements 4.1 General 4.2 Assembly data 4.3 Prerequisite for storage 4.4 Damage to die products during long-term storage |
| 14 | 4.5 Mechanical storage conditions 4.6 Long-term storage environment |
| 15 | 4.7 Recommended inert atmosphere purity 4.8 Chemical contamination 4.9 Vacuum packing 4.9.1 General 4.9.2 Vacuum dry pack 4.10 Positive pressure systems for packing 4.11 Use of packing material having sacrificial properties |
| 16 | 4.12 Use of bio-degradable material 4.13 Plasma cleaning 4.14 Electrical effects 4.15 Protection from radiation 4.16 Periodic qualification of stored die products |
| 17 | 5 Long-term storage failure mechanisms 6 LTS concerns, method, verification and limitations 6.1 General 6.2 Wafers |
| 18 | 6.3 Bare dice Table 1 – LTS exposure concerns for wafers |
| 19 | 7 Deterioration mechanisms specific to bare die and wafers 7.1 Wire bondability 7.2 Staining Table 2 – LTS exposure concerns for bare dice |
| 20 | 7.3 Topside delamination 8 Specific handling concerns 8.1 Die on wafer film frames 8.2 Devices and dice embossed or punched tape storage 8.3 Handling damage |
| 21 | Annex A (informative) Audit checklist Table A.1 – Planning checklist (1 of 3) |
| 24 | Bibliography |
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BS EN 62435-5:2017
Electronic components. Long-term storage of electronic semiconductor devices – Die and wafer devices Published By…
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BS EN 62435-5:2017
Electronic components. Long-term storage of electronic semiconductor devices – Die and wafer devices Published By…
