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BS EN IEC 60749-37:2022

BS EN IEC 60749-37:2022

$142.49

Semiconductor devices. Mechanical and climatic test methods – Board level drop test method using an accelerometer

Published By Publication Date Number of Pages
BSI 2022 28
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IEC 60749-37:2022 is available as IEC 60749-37:2022 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: – correction of a previous technical error concerning test conditions; – updates to reflect improvements in technology.

PDF Catalog

PDF Pages PDF Title
2 undefined
7 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
8 Blank Page
9 English
CONTENTS
10 FOREWORD
12 INTRODUCTION
13 1 Scope
2 Normative references
3 Terms and definitions
14 4 Test apparatus and components
4.1 Test apparatus
15 4.2 Test components
4.3 Test board
4.4 Test board assembly
16 4.5 Number of components and sample size
5 Test procedure
5.1 Test equipment and parameters
Table 1 – Quantity of test boards and components required for testing
17 Figure 1 – Drop test apparatus detail
18 5.2 Pre-test characterization
Figure 2 – Calculation of velocity change
19 5.3 Drop testing
Figure 3 – Typical shock test half-sine pulse graphic and formulae
20 6 Failure criteria and failure analysis
21 7 Summary
22 Annex A (informative) Preferred board construction, material, design and layout
A.1 Preferred board construction, material and design
Table A.1 – Test board stack-up and material
23 Table A.2 – Mechanical property requirements for dielectric materials
24 A.2 Preferred test board size, layout, and component locations
Table A.3 – Recommended test board pad sizes and solder mask openings
25 Figure A.1 – Board footprint and BGA layout
26 Figure A.2 – Test vehicle with 4 component placement (top side – left) and 1 component at center location (bottom side – right).
27 Bibliography

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BS EN IEC 60749-37:2022
$142.49