šŸ”„šŸ”„ Donā€™t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

šŸ”
BS EN IEC 61189-5-301:2021

BS EN IEC 61189-5-301:2021

$167.15

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Soldering paste using fine solder particles

Published By Publication Date Number of Pages
BSI 2021 38
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. Weā€™re here to assist you 24/7.
Email:[email protected]

IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using fine solder particle such as type 6, type 7 specified in IEC 61190-1-2 or finer particle sizes. This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 Āµm or less). Test methods for the characteristics of solder paste in this document are considering the effect of surface activation force due to the fine sized solder particles which could affect the test result by existing test methods.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publicationswith their corresponding European publications
7 English
CONTENTS
9 FOREWORD
11 1 Scope
2 Normative references
3 Terms and definitions
12 4 Powder particle size distribution measurement
4.1 General
4.2 Powder particle size distribution measurement ā€“ Scanning electron microscope
4.2.1 Object
4.2.2 Equipment/apparatus
4.2.3 Procedure
4.2.4 Evaluation
4.3 Powder particle size distribution measurement ā€“ Laser diffraction
4.3.1 Object
4.3.2 Equipment/apparatus
4.3.3 Procedure
13 4.3.4 Evaluation
4.4 Powder particle size distribution measurement ā€“ Digital microscope
4.4.1 Object
4.4.2 Equipment/apparatus
4.4.3 Procedure
4.4.4 Evaluation
5 Solder paste viscosity
5.1 Method A:Trace spiral pump method
5.1.1 Object
14 5.1.2 Equipment/apparatus
5.1.3 Procedure
Tables
Table 1 ā€“ QC procedure for Trace spiral-type viscometer
15 5.1.4 Evaluation
5.2 Method B: Spiral pump method (IEC 61189-5-3, Test 5-3X06: Solder paste viscosity ā€“ Spiral pump method (applicable to 300 PaĀ·s)
5.2.1 Object
5.2.2 Test specimen
5.2.3 Equipment/apparatus
5.2.4 Procedure
16 5.2.5 Evaluation
5.3 Additional information
Table 2 ā€“ QC procedure for spiral-type viscometer according to Test 5-3X06 in IEC 61189-5-3
17 6 Printability test
6.1 Object
6.2 Equipment/apparatus
18 Figures
Figure 1 ā€“ Metal mask for printability test
19 6.3 Procedure
6.4 Evaluation
Figure 2 ā€“ Test board with slits for splitting
20 7 Slump test
7.1 Object
7.2 Equipment/apparatus
7.3 Procedure
Table 3 ā€“ Evaluation index for printability test
21 7.4 Evaluation
8 Reflow test
8.1 Object
8.2 Equipment/apparatus
8.3 Procedure
Figure 3 ā€“ Temperature profile for slump test
22 8.4 Evaluation
Figure 4 ā€“ Temperature profile for reflow test
23 9 High temperature observation test
9.1 Object
9.2 Equipment/apparatus
Table 4 ā€“ Evaluation index for reflow test
24 Figure 5 ā€“ Metal mask for high temperature observation test
25 9.3 Procedure
Figure 6 ā€“ Example structure of high temperature observation apparatus
26 9.4 Evaluation
27 Annex A (informative) Example of the test report on powder particle size distribution measurement
28 Annex B (informative)Example of the test report on viscosity characteristics
29 Annex C (informative)Example of the test report on printability test
C.1 Test report form
30 C.2 Test report entry example
31 Annex D (informative)Example of the test report on slump test
32 Annex E (informative)Example of the test report on reflow test
E.1 Test report form
33 E.2 Test report entry example
34 Annex F (informative)Example of the test report on high temperature observation test
F.1 Test report form
35 F.2 Melting property report form
F.3 Entry example for melting property
36 Annex G (informative)Example pictures of the printing and reflow test
G.1 Printing test
37 G.2 Reflow test

Related products

BS EN IEC 61189-5-301:2021
$167.15