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BS EN IEC 61189-5-601:2021

BS EN IEC 61189-5-601:2021

$189.07

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Published By Publication Date Number of Pages
BSI 2021 46
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IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys. The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts). The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA(normative)Normative references to international publications with their corresponding European publications
7 English
CONTENTS
11 FOREWORD
13 1 Scope
2 Normative references
Tables
Table 1 – Test items defined in this document
14 3 Terms and definitions
15 4 Grouping of soldering processes and related test severities
16 5 Specimens
5.1 Devices
Table 2 – Grouping of soldering processes and typical test severities – Overview
17 Figures
Figure 1 – Example of a test circuit for the electrical continuity test of a solder joint
Figure 2 – Example of area array type packages
Figure 3 – Example of leaded type devices
Figure 4 – Example of leadless termination type devices
18 5.2 Test substrate
5.3 Solder paste
Figure 5 – Example of connector for card type devices
Figure 6 – Example of shielding metal components
19 5.4 Solder ball
6 Apparatus and equipment
6.1 Constant temperature and humidity testing equipment
Figure 7 – Recommended solder ball shape
20 6.2 Device-mounting equipment
6.3 X-ray transmission equipment
6.4 Electrical resistance recorder
6.5 Warpage measurement equipment
Table 3 – Stencil design standard for devices
21 6.6 Temperature cycling chamber
6.7 Pull strength test equipment
7 Tg1 Solder joint initial quality after reflow
7.1 General
7.2 Specimen preparation
7.3 Pre-process
7.3.1 Pre-conditioning
7.3.2 Initial measurement
Figure 8 – Test procedure for Tg1
22 7.3.3 Moistening process (1)
7.3.4 Baking and warp correction
7.3.5 Pre-reflow heating
7.3.6 Moistening process (2)
7.4 Assembly process
7.4.1 Solder paste printing
23 7.4.2 Device mounting
Figure 9 – Example of printed conditions of solder paste
Figure 10 – Typical reflow soldering profile for Sn63Pb37 solder alloy
24 Figure 11 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy
25 Figure 12 – Reflow temperature profile for soldering ability
Table 4 – Maximum reflow heating conditions
26 7.4.3 Reflow heating
Figure 13 – Temperature measurement of the package device using thermocouples
Figure 14 – Temperature measurement of other specimen using thermocouples
Table 5 – Minimum reflow heating conditions
27 7.5 Recovery
7.6 Final measurement
8 Tg2 warpage of component and printed boards in reflow process
8.1 General
8.2 Specimen preparation
Figure 15 – Test procedure for Tg2
28 8.3 Assembly process
8.3.1 Initial measurement
8.3.2 Baking and warp correction
8.3.3 Pre-reflow heating
8.4 Final measurement
8.4.1 Warpage measurement
8.4.2 Measurement area
8.4.3 Gap measurement
29 Figure 16 – Contact point
30 9 Tg3 Resistance to soldering heat of printed boards
9.1 General
Figure 17 – Maximum gap
31 9.2 Specimen preparation
9.3 Pre-process
9.3.1 Pre-conditioning
9.3.2 Initial measurement
9.3.3 Moistening process (1)
9.3.4 Baking and warp correction
9.4 Reflow heating
Figure 18 – Test procedure for Tg3
32 9.5 Final measurement
10 Tg4 Wetting and dewetting of a printed-board land
10.1 General
10.2 Specimen preparation
10.3 Pre-process
10.3.1 Pre-conditioning
Figure 19 – Test procedure for Tg4
33 10.3.2 Initial measurement
10.3.3 Moistening process (1)
10.3.4 Pre-baking
10.3.5 Pre-reflow heating
10.3.6 Moistening process (2)
10.4 Assembly process
10.4.1 Solder paste printing
10.4.2 Reflow heating
34 10.5 Final measurement
10.5.1 Measurement
Table 6 – Wetting level
35 10.5.2 Flux removal
11 Tg5 Resistance to dissolution of a printed-board land
11.1 General
Figure 20 – State of solder wetting
Figure 21 – Solder contact angle
36 11.2 Specimen preparation
11.3 Pre-process
11.3.1 Pre-conditioning
11.3.2 Initial measurement
11.4 Assembly process
11.4.1 Solder paste printing
11.4.2 Reflow heating
11.5 Final measurement
11.5.1 Observation
Figure 22 – Test procedure for Tg5
37 11.5.2 Observation method
11.5.3 Measurement
Figure 23 – Evaluation of resistance to dissolution of land
38 11.5.4 Example of influence upon occurrence of dissolution
12 Tg6 Pull strength of the test substrate land
12.1 General
Figure 24 – Cross-section observation
39 12.2 Specimen preparation
12.3 Pre-process
12.3.1 Pre-conditioning
12.3.2 Initial measurement
12.3.3 Pre-baking
12.3.4 Pre-reflow heating
12.4 Assembly process
12.4.1 Solder paste printing
12.4.2 Solder ball placement
Figure 25 – Test procedure for Tg6
40 12.4.3 Reflow heating process
12.5 Final measurement
12.5.1 Pull strength measurement
12.5.2 Pull strength measuring method A – Probe heat bond method
12.5.3 Pull strength measuring method B – Ball pinch method
Figure 26 – Measuring methods for pull strength
41 12.5.4 Pull strength measuring method C – Pin pull down method
12.5.5 Pull strength measuring method D – Lead pull method
12.5.6 Final observation
42 Figure 27 – Breaking modes in pull strength test
43 Annex A (informative)Test process items and meaning of processing contents and condition
A.1 General
A.2 Meaning of processing contents and condition
A.3 Test process items
Table A.1 – Meaning of processing contents and condition
44 Table A.2 – Test process items and clauses
45 Bibliography

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BS EN IEC 61189-5-601:2021
$189.07