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BS EN IEC 61190-1-3:2018

BS EN IEC 61190-1-3:2018

$189.07

Attachment materials for electronic assembly – Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Published By Publication Date Number of Pages
BSI 2018 50
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This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for “special” electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material’s performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.

PDF Catalog

PDF Pages PDF Title
2 undefined
7 English
CONTENTS
10 FOREWORD
12 INTRODUCTION
13 1 Scope
2 Normative references
3 Terms and definitions
16 4 Classification
4.1 General
4.2 Alloy composition
17 4.3 Solder form
4.4 Flux type
Tables
Table 1 – Solder materials
18 4.5 Flux percentage and metal content
Table 2 – Flux types and designating symbols
19 4.6 Other characteristics
5 Requirements
5.1 Materials
5.2 Alloys
5.2.1 General
5.2.2 Variation D alloys
Table 3 – Flux percentage
20 5.3 Solder forms
5.3.1 General
5.3.2 Bar solder
5.3.3 Wire solder
5.3.4 Ribbon solder
5.3.5 Solder powder
21 5.3.6 Special solder
5.4 Flux type and form
5.4.1 General
5.4.2 Flux percentage
Table 4 – Standard solder powders
22 5.4.3 Solder cores
5.4.4 Solder coatings
5.5 Flux residue dryness
5.6 Spitting
5.7 Solder pool
5.8 Labelling for product identification
23 5.9 Workmanship
6 Quality assurance provisions
6.1 Responsibility for inspection and compliance
6.1.1 General
6.1.2 Quality assurance programme
6.1.3 Test equipment and inspection facilities
6.1.4 Inspection conditions
6.2 Classification of inspections
24 Figures
Figure 1 – Report form for solder alloy tests
25 Figure 2 – Report form for solder powder tests
26 Figure 3 – Report form for non-fluxed solder tests
27 Figure 4 – Report form for fluxed wire/ribbon solder tests
28 6.3 Inspection of materials
6.4 Qualification inspections
6.4.1 General
6.4.2 Sample size
6.4.3 Inspection routine
Table 5 – Solder inspections
29 6.5 Quality conformance
6.5.1 General
6.5.2 Inspection routine
6.5.3 Sampling plan
6.5.4 Rejected lots
6.6 Preparation of solder alloy for test
6.6.1 General
6.6.2 Wire solder up to approximately 6 mm diameter
6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter
7 Preparation for delivery – Preservation, packing and packaging
30 Annex A (informative)Selection of various alloys and fluxes for use in electronic soldering –General information concerning IEC 61190-1-3
A.1 Overview
A.2 Intended use
A.2.1 General
A.2.2 Alloys
31 A.3 Acquisition requirements
32 A.4 Standard solder product packages
A.4.1 General
A.4.2 Wire and ribbon solders
A.4.3 Bar solders
A.4.4 Solder powder
33 A.5 Protocol for establishing short names for IEC 61190-1-3 alloys
A.5.1 Lead containing solder alloys and specialty alloy
A.5.2 Lead-free solder alloys
34 A.6 Standard description of solid solder products
35 Annex B (normative)Lead-free solder alloys
Table B.1 – The composition and temperature characteristicsof lead-free solder alloys
38 Table B.2 – The composition and temperature characteristicsof common tin-lead alloys
41 Table B.3 – The composition and temperature characteristics for specialty (non-tin/lead) alloys
42 Table B.4 – the cross-reference from solidus and liquidus temperaturesto alloy names by temperature
44 Table B.5 – The cross-reference from ISO 9453 alloy numbers and designationsto IEC 61190-1-3 alloy names
46 Annex C (informative)Marking method of solder designation for mounted board,used in electronic equipment
C.1 General
C.2 Marking
C.2.1 Recommendation for marking
C.2.2 Marking for solder designation
47 C.2.3 Marking unit and location
Figure C.1 – Example of the marking for assembled board
48 Bibliography

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BS EN IEC 61190-1-3:2018
$189.07