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BS EN IEC 63251:2023

BS EN IEC 63251:2023

$142.49

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Published By Publication Date Number of Pages
BSI 2023 26
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This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

PDF Catalog

PDF Pages PDF Title
2 undefined
5 Annex ZA (normative)Normative references to international publicationswith their corresponding European publications
6 English
CONTENTS
8 FOREWORD
10 1 Scope
2 Normative references
3 Terms and definitions
11 4 Test method
4.1 General
4.2 Test sample
Figures
Figure 1 – Schematic diagram of FOECB (top view)
12 4.3 Test process
4.3.1 General description of the test
Figure 2 – Schematic diagrams of the FOECB test samples of fibre type
Figure 3 – Schematic diagram of the FOECB test samples of fibre type
13 4.3.2 Preconditioning
4.3.3 Test
4.3.4 Recovery
Table 1 – Thermal endurance test class for FOECB
14 4.3.5 Final measurements
5 Report
15 Annex A (informative)Example of optical bending loss test resultswith general glass optic fibres
Figure A.1 – Bending loss test setup
Figure A.2 – Optical loss versus bending diameter
16 Annex B (informative)Example of preparation method of O-E circuit test samples(optic fibre type)
B.1 General
B.2 Manufacturing processes of the FOECBs with optic fibres (POF, GOF)
Figure B.1 – Arrayed structure of the FOECB test samples formed on one sheet
17 B.3 Manufacturing processes of the FOECBs with optical polymer waveguides
Figure B.2 – Fabrication of the optic circuits with optic fibres
Figure B.3 – Fabrication of the optic circuits with optic polymerwaveguide via the photo-etching method
18 B.4 Characteristics of the optic fibres
19 Annex C (informative)Example of reflow assembly simulation test results
C.1 General
C.2 Results of reflow assembly simulation test for a LED chip mounted FOECB with GOF
Figure C.1 – LED chip mounted FOECB
Figure C.2 – Appearance of a LED chip mounted FOECB afterthe reflow assembly simulation test
20 C.3 Results of reflow assembly simulation test for a transparent FOECB with GOF for display applications
C.4 Results of reflow assembly simulation test for a polyimide (PI) based FOECB with GOF
Figure C.3 – Appearance of a transparent FOECB with GOFs afterthe reflow assembly simulation test
Figure C.4 – Appearance of a PI based FOECB with GOF afterthe reflow assembly simulation test
21 C.5 Results of reflow assembly simulation test for a polymer-based FOECB
Figure C.5 – Appearance of a polymer-based FOECB afterthe reflow assembly simulation test
22 Annex D (informative)Example of thermal shock endurance test results
D.1 General
D.2 Results of thermal shock endurance test for an FOECB with GOF
Figure D.1 – Appearance of an FOECB with GOF after the thermal shock test
23 Annex E (informative)Example of humidity storage test results
E.1 General
E.2 Results of humidity storage test for an FOECB with GOF
E.3 Results of humidity storage test for an FOECB with POF
Figure E.1 – Appearance of an FOECB with GOF after the humidity storage test
24 Figure E.2 – Appearance of an FOECB with POF after the humidity storage test
25 Bibliography

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BS EN IEC 63251:2023
$142.49