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BS IEC 60115-4:2022:2023 Edition

BS IEC 60115-4:2022:2023 Edition

$215.11

Fixed resistors for use in electronic equipment – Sectional specification: Power resistors for through hole assembly on circuit boards (THT) or for assembly on chassis

Published By Publication Date Number of Pages
BSI 2023 118
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 Blank Page
5 CONTENTS
11 FOREWORD
14 1 Scope
2 Normative references
15 3 Terms, definitions, product types, product technologies and product classification
3.1 Terms and definitions
16 3.2 Product types
3.2.1 General
3.2.2 Axial type
3.2.3 Radial type
Figures
Figure 1 – Illustrations of typical axial leaded power resistors
Figure 2 – Illustrations of typical radial leaded power resistors
17 3.2.4 Vertical type
3.2.5 Tubular types
Figure 3 – Illustrations of typical vertical leaded power resistors with punched terminals
Figure 4 – Illustrations of typical tubular type power resistors
18 3.2.6 Metal housed wire-wound resistors
3.2.7 Any other type
3.3 Resistor encapsulation and material of termination
3.3.1 Conformal lacquer coat
3.3.2 Silicone cement coating
Figure 5 – Illustrations of typical metal housed power resistors
19 3.3.3 Enamel coating
3.3.4 Ceramic housed resistor
3.3.5 Wire termination
3.4 Product technologies
3.4.1 General
20 3.4.2 Metal film technology
3.4.3 Metal glaze technology
3.4.4 Metal oxide technology
3.4.5 Wire-wound technology
3.4.6 Metal strip technology
21 3.4.7 Any other technology
3.5 Product classification
4 Preferred characteristics
4.1 General
4.2 Preferred types, styles and dimensions
4.2.1 Axial type
22 Figure 6 – Shape and dimensions of cylindrical axial leaded resistors
Tables
Table 1 – Examples of preferred styles of cylindrical axial leaded power resistors
23 Figure 7 – Alternative methods for specification of the length of excessive protective coating or welding beads on axial leaded resistors
24 Figure 8 – Lead-wire spacing of axial leaded resistors with bent leads
25 4.2.2 Ceramic housed type with axial lead wires
Figure 9 – Specification of the lead eccentricity of axial leaded resistors
Figure 10 – Shape and dimensions of axial leaded ceramic housed resistors
26 4.2.3 Ceramic housed type with radial lead wires
Table 2 – Examples of preferred styles of axial leaded ceramic housed resistors
27 Figure 11 – Shape and dimensions of radial type ceramic resistors
Table 3 – Examples of preferred styles of radial type ceramic resistors
28 4.2.4 Radial or vertical ceramic housed type and dimensions
Figure 12 – Shape and dimensions of radial leaded ceramic resistors
29 4.2.5 Tubular type of power resistors
Figure 13 – Shape and dimensions of tubular resistors
Table 4 – Preferred styles of radial or vertical mount ceramic resistors
30 4.2.6 Other types
4.3 Preferred climatic categories
Table 5 – Example of preferred styles of tubular types of power resistors
31 4.4 Resistance
4.5 Tolerances on resistance
4.6 Rated dissipation Pr
32 Figure 14 – Typical derating curve for MET > UCT
Figure 15 – Typical derating curve for power wire-wound resistors
33 4.7 Limiting element voltage Umax
4.8 Insulation voltage Uins
4.9 Insulation resistance Rins
5 Tests and test severities
5.1 General provisions for tests invoked by this specification
34 5.2 Preparation of specimen
5.2.1 Drying
5.2.2 Mounting of power resistors on test boards
35 5.2.3 Mounting of power resistors on test racks
Figure 16 – Assembly of specimen to the test board
36 Figure 17 – Mounting of axial leaded specimens on a rack, top view
37 5.2.4 Specification of test boards/ racks for any other type of high-power resistors
5.3 Details of applicable tests
5.3.1 Resistance
5.3.2 Temperature coefficient of resistance
Figure 18 – Examples of specimen lead fixation devices
38 5.3.3 Temperature rise
5.3.4 Endurance at the rated temperature 70 °C
39 5.3.5 Endurance at room temperature
40 5.3.6 Endurance at a maximum temperature: UCT with category dissipation
5.3.7 Short-term overload
41 5.3.8 Single-pulse high-voltage overload test
5.3.9 Periodic-pulse high-voltage overload test
43 5.3.10 Visual examination
5.3.11 Gauging of dimensions
Table 6 – Preferred alternative overload conditions
44 5.3.12 Detail dimensions
5.3.13 Robustness of the resistor body
5.3.14 Robustness of terminations
45 5.3.15 Bump
5.3.16 Shock
5.3.17 Vibration
46 5.3.18 Rapid change of temperature
5.3.19 Rapid change of temperature, ≥ 100 cycles
5.3.20 Climatic sequence
47 5.3.21 Damp heat, steady state
48 5.3.22 Solderability, with lead-free solder
49 5.3.23 Solderability, with SnPb solder
5.3.24 Resistance to soldering heat
50 5.3.25 Solvent resistance
5.3.26 Insulation resistance
5.3.27 Voltage proof
51 5.4 Optional and/or additional tests
5.4.1 Single-pulse high-voltage overload test
5.4.2 Periodic-pulse overload test
52 5.4.3 Electrostatic discharge (ESD)
5.4.4 Robustness of threaded stud or screw terminations
53 5.4.5 Operation at low temperature
5.4.6 Damp heat, steady state, accelerated
54 5.4.7 Accidental overload test
5.4.8 Flammability
55 6 Performance requirements
6.1 General
6.2 Limits for change of resistance at test
56 Table 7 – Limits for resistance variations at tests
57 6.3 Temperature coefficient of resistance
6.4 Temperature rise
Table 8 – Permitted change of resistance due to the temperature coefficient of resistance
58 6.5 Visual inspection
6.5.1 General visual criteria
6.5.2 Visual criteria after tests
6.5.3 Visual criteria for the packaging
6.6 Solderability
59 6.7 Insulation resistance
6.8 Flammability
6.9 Accidental overload test
7 Marking, packaging and ordering information
7.1 Marking of the component
7.2 Packaging
60 7.3 Marking of the packaging
7.4 Ordering information
8 Detail specifications
8.1 General
61 8.2 Information to be specified in a detail specification
8.2.1 Outline drawing or illustration
8.2.2 Type, style, and dimensions
8.2.3 Climatic category
8.2.4 Resistance range
8.2.5 Tolerances on rated resistance
8.2.6 Rated dissipation P70
62 8.2.7 Limiting element voltage Umax
8.2.8 Insulation voltage Uins
8.2.9 Insulation resistance Rins
8.2.10 Tests and test severities
8.2.11 Limits of resistance change after testing
8.2.12 Temperature coefficient of resistance
8.2.13 Marking
8.2.14 Ordering information
8.2.15 Mounting
63 8.2.16 Storage
8.2.17 Transportation
8.2.18 Additional information
8.2.19 Quality assessment procedures
9 Quality assessment procedures
9.1 General
9.2 Definitions
9.2.1 Primary stage of manufacture
9.2.2 Structurally similar components
64 9.2.3 Assessment level EZ
9.3 Formation of inspection lots
65 9.4 Approved component (IECQ AC) procedures
9.5 Qualification approval (QA) procedures
9.5.1 General
9.5.2 Qualification approval
9.5.3 Quality conformance inspection
66 9.6 Capability certification (IECQ AC-C) procedures
9.7 Technology certification (IECQ-AC-TC) procedures
9.8 Periodical evaluation of termination platings
9.9 Delayed delivery
9.10 Certified test records
9.11 Certificate of conformity (CoC)
67 Table 9 – Test schedule for the qualification approval of power resistors
72 Table 10 – Test schedule for quality conformance inspection of power resistors
77 Annex A (normative)Symbols and abbreviated terms
A.1 Symbols
80 A.2 Abbreviated terms
82 Annex B (normative)Visual inspection acceptance criteria
B.1 General
B.2 Acceptance criteria for a general visual inspection of body of specimens
B.3 Acceptance criteria for a general visual inspection of the terminals
B.4 Acceptance criteria for a general visual inspection of specimen after test
83 Annex C (normative)Workmanship requirements for the assembly of power resistors
C.1 General
C.2 Lead forming
C.2.1 General
Figure C.1 – Lead forming dimensions
84 C.2.2 Means for support of mounting height
Table C.1 – Lead bend radius
85 C.3 Mounting
C.3.1 General
Figure C.2 – Examples of mounting height support
Table C.2 – Recommended circuit board bore diameters
86 C.3.2 Lateral mounting
Figure C.3 – Clearance between coating and solder
Figure C.4 – Lateral mounting
87 C.3.3 Upright mounting
Figure C.5 – Upright mounting
Table C.3 – Clearance of lateral mounted resistors
88 C.4 Lead trimming
Figure C.6 – Lead protrusion
89 Figure C.7 – Lead end distortion
90 Annex D (informative)Zero ohm resistors (jumpers)
91 Annex E (informative)Guide on the application of optional and/or additional tests
E.1 General
E.2 Endurance at room temperature
92 E.3 Single-pulse high-voltage overload test
Table E.1 – Implementation of the test endurance at room temperature
93 E.4 Periodic-pulse overload test
Table E.2 – Implementation of the single-pulse high-voltage overload test
94 E.5 Operation at low temperature
Table E.3 – Implementation of the periodic-pulse overload test
95 E.6 Damp heat, steady state, accelerated
Table E.4 – Implementation of the operation at low temperature test
96 E.7 Accidental overload test
Table E.5 – Implementation of the test damp heat, steady state, accelerated
97 E.8 Flammability test
Table E.6 – Implementation of the test accidental overload test
98 E.9 Electrostatic discharge test (ESD)
Table E.7 – Implementation of the test flammability
99 E.10 Robustness of threaded stud or screw terminations
Table E.8 – Implementation of the test Electrostatic discharge (ESD)
100 Table E.9 – Implementation of the test Robustness of threaded stud or screw terminations
101 Annex F (informative)Radial formed types from axial styles
F.1 General
F.1.1 Applicability of this annex
F.1.2 Denomination of radial formed styles
102 Figure F.1 – Production flow and different scopes of quality assurance
103 F.1.3 Coated lead wires
F.1.4 Means for support of mounting height
104 F.1.5 Means for retention
F.2 Radial formed types for through hole assembly
F.2.1 Radial formed style with lateral body position
Figure F.2 – Shape and dimensions of radial formed resistorfor lateral body position
Figure F.3 – Shape and dimensions of radial formed resistor for lateral body position with kinked lead wires
105 Table F.1 – Feasible lead-wire spacing of radial formed resistor for lateral body position
106 F.2.2 Radial formed style with upright body position
Figure F.4 – Shape and dimensions of radial formed resistor for upright body position
Figure F.5 – Shape and dimensions of radial formed resistor for upright body position and wide spacing
107 Figure F.6 – Shape and dimensions of radial formed resistor for upright body position and wide spacing, with kinked lead wire
108 F.3 Radial formed types for surface-mount assembly
Figure F.7 – Shape and dimensions of radial formed resistor for surface-mount assembly (Z-bend)
Table F.2 – Feasible lead-wire spacing of radial formed resistor for upright body position
109 F.4 Packaging
F.4.1 Packaging of resistors formed for through-hole assembly
Figure F.8 – Land pattern dimensions for surface-mount assembly
110 F.4.2 Packaging of resistors formed for surface-mount assembly
F.5 Quality assessment
F.5.1 General
F.5.2 Quality assessment of formed resistors
111 F.5.3 Forming of finished resistors of assessed quality
F.5.4 Special inspection requirements
112 Annex X (informative)Cross references for the prior revision of this specification
113 Table X.1 – Cross reference for references to clauses
114 Table X.2 – Cross reference for references to figures
Table X.3 – Cross reference for references to tables
115 Bibliography

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