BS IEC 62047-29:2017:2018 Edition
$102.76
Semiconductor devices. Micro-electromechanical devices – Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 16 |
IEC 62047-29:2017(E) specifies a relaxation test method for measuring electromechanical properties of freestanding conductive thin films for micro-electromechanical systems (MEMS) under controlled strain and room temperature. Freestanding thin films of conductive materials are extensively utilized in MEMS, opto-electronics, and flexible/wearable electronics products. Freestanding thin films in the products experience external and internal stresses which could be relaxed even under room temperature during a period of operation, and this relaxation leads to time-dependent variation of electrical performances of the products. This test method is valid for isotropic, homogeneous, and linearly viscoelastic materials.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 5 | FOREWORD |
| 7 | 1 Scope 2 Normative references 3 Terms and symbols 3.1 Terms and definitions |
| 8 | 3.2 Symbols and designations Figures Figure 1 – Freestanding test piece Table 1 – Symbols and designations of a test piece |
| 9 | 4 Test piece 4.1 General 4.2 Shape of a test piece 4.3 Measurement of dimensions 5 Test principle and test apparatus 5.1 Test principle 5.2 Test environment 5.3 Test machine |
| 10 | 5.4 Test procedure 5.5 Data analysis Figure 2 – Experimental setup |
| 11 | 6 Test report |
| 12 | Annex A (informative) Electromechanical relaxation test example of freestanding Au film A.1 Testing overview Figure A.1 – Photograph of test equipment and a schematicfor experimental setup |
| 13 | A.2 Testing results |
| 14 | Figure A.2 – Electromechanical relaxation data of freestanding Au film with a thickness of 1 μm |
