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BS IEC 62951-1:2017:2018 Edition

BS IEC 62951-1:2017:2018 Edition

$102.76

Semiconductor devices. Flexible and stretchable semiconductor devices – Bending test method for conductive thin films on flexible substrates

Published By Publication Date Number of Pages
BSI 2018 18
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This part of IEC 62951 specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates. Conductive thin films on flexible substrates are extensively used in flexible electronic devices and flexible semiconductors. Conductive thin films include any films deposited or bonded onto a non-conductive flexible substrate such as thin metal film, transparent conducting electrode, and thin silicon film. The electrical and mechanical behaviours of thin films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions and adhesion between the film and substrate. The object of this standard is to establish simple and repeatable test methods for evaluating the electromechanical properties or flexibility of conductive thin films on flexible substrate. The bending test methods include outer bending test and inner bending test.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
8 3.2 Symbols and designations
9 4 Test piece
4.1 Design of test piece
4.2 Preparation of a test piece
4.3 Measurement of dimensions
Figures
Figure 1 ā€“ Shape of a test piece
Table 1 ā€“ Symbols and designations of a test piece
10 4.4 Storage prior to testing
5 Testing method and test apparatus
5.1 General
5.2 Test apparatus
5.3 Measurement of electrical resistance
Figure 2 ā€“ Bending test apparatus
11 5.4 Test procedure
5.5 Observation of cracks in test piece
5.6 Data analysis
5.7 Test environment
12 6 Test report
13 Annex A (informative) X-Y-Īø bending test method
Figure A.1 ā€“ X-Y-( bending test method
14 Figure A.2 ā€“ Schematic of the bending geometry in X-Y-Īø system
15 Annex B (informative) Data analysis: Calculation of bending radius and bending strain
B.1 Calculation of bending radius
B.2 Calculation of bending strain of the film
Figure B.1 ā€“ Geometrical shape of bent test piece
17 Bibliography

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BS IEC 62951-1:2017
$102.76