BSI 19/30400493 DC:2019 Edition
$13.70
BS EN IEC 61188-6-2. Printed boards and printed board assemblies. Design and use – Part 6-2. Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
| Published By | Publication Date | Number of Pages |
| BSI | 2019 | 26 |
| Status | Definitive |
|---|---|
| Pages | 26 |
| Publication Date | 2019-08-07 |
| Standard Number | 19/30400493 DC |
| Title | BS EN IEC 61188-6-2. Printed boards and printed board assemblies. Design and use – Part 6-2. Land pattern design. Description of land pattern for the most common surface mounted components (SMD) |
| Identical National Standard Of | 91/1604/CD |
| Descriptors | Soldering, Printed-circuit boards, Printed circuits, Integrated circuits, Electronic equipment and components, Design, Dimensional tolerances, Dimensions |
| Publisher | BSI |
| Committee | EPL/501 |
| ICS Codes | 31.190 - Electronic component assemblies |
