BSI 22/30443234 DC 2022
$13.70
BS EN 63378-3. Thermal standardization on semiconductor packages – Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis
Published By | Publication Date | Number of Pages |
BSI | 2022 | 19 |
Status | Definitive |
---|---|
Pages | 19 |
Publication Date | 2022-01-24 |
Standard Number | 22/30443234 DC |
Title | BS EN 63378-3. Thermal standardization on semiconductor packages – Part 3. Thermal circuit simulation models of semiconductor packages for transient analysis |
Identical National Standard Of | IEC 63378-3 ED1 |
Descriptors | Semiconductor manufacture, Semiconductor materials, Semiconductor technology, Protection (thermal), Resistance (thermal), Stability (thermal), Thermal measuring, Thermal diffusion |
Publisher | BSI |
Committee | EPL/47 |
ICS Codes | 31.080.01 - Semiconductor devices in general |