🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BSI 23/30469486 DC 2023

BSI 23/30469486 DC 2023

$13.70

BS EN IEC 63378-2. Thermal standardization on semiconductor packages – Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis

Published By Publication Date Number of Pages
BSI 2023 18
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

PDF Catalog

PDF Pages PDF Title
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms and definitions
4 Attributes of 3D thermal models
4.1 General
4.2 TO-243
10 4.3 TO-252
12 4.4 TO-263
15 Annex A (normative) Contribution analysis in case of TO-252
A.1 Attributes of JTAM
17 A.2 Simulation validation
18 Bibliography

Related products

BSI 23/30469486 DC 2023
$13.70