BSI 24/30486622 DC 2024
$13.70
BS EN IEC 62047-49. Semiconductor devices. Micro-electromechanical devices – Part 49. Reliability test methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
Published By | Publication Date | Number of Pages |
BSI | 2024 | 11 |
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | 30486622-NC.pdf |
3 | 47F_462e_CD.pdf |
5 | FOREWORD |
7 | 1 Scope 2 Normative references 3 Terms and definitions |
8 | 4 Test bed of MEMS piezoelectric thin film 4.1 General 4.2 Initial measurements 4.3 Tests 4.3.1 DUT setup and environmental conditions |
9 | 4.3.2 Test duration 4.3.3 Number of tests and number of DUTs 4.4 Final measurements 5 Environmental and dielectric withstand testing 5.1 Environmental testing 5.1.1 General |
10 | 5.1.2 High-temperature bias test 5.1.3 High-temperature and high-humidity bias test |
11 | 5.1.4 High-temperature storage 5.1.5 High-temperature and high-humidity storage |