BSI DD IEC/PAS 62483:2006 2007

$142.49

Test method for measuring whisker growth on tin and tin alloy surface finishes

Published By	Publication Date	Number of Pages
BSI	2007	30

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Provides the methodology applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document

Additional information

Status	Withdrawn
Title	Test method for measuring whisker growth on tin and tin alloy surface finishes
Publisher	BSI
Committee	EPL/47
Pages	30
Publication Date	2007-02-28
Withdrawn Date	2013-10-31
Replaced By	BS IEC 62483:2013
ISBN	978 0 580 50147 0
Standard Number	DD IEC/PAS 62483:2006
Identical National Standard Of	IEC/PAS 62483:2006
Descriptors	Tin, Tin alloys, Electronic equipment and components, Electroplating, Solders, Testing conditions, Corrosion, Metal coatings, Environmental testing, Surfaces, Finishes, Surface defects, Electrical components
ICS Codes	31.080.01 - Semiconductor devices in general

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BSI DD IEC/PAS 62483:2006 2007

$142.49


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