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BSI DD IEC/TS 62610-2:2011

$102.76

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Design guide. Method for the determination of forced air-cooling structure

Published By Publication Date Number of Pages
BSI 2011 20
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This part of IEC 62610 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series.

This design guide contains the following:

  1. Thermal interfaces of subrack and/or chassis based equipment in a cabinet

    • Reference temperature

    • Preferred airflow conditions

    • Airflow volume conditions

    • Standard air

  2. Procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions

The drawings used are not intended to indicate product design. They are only explanatory indications for determining forced air-cooling structure.

The terminology used complies with IEC 60917-1.

PDF Catalog

PDF Pages PDF Title
4 English
CONTENTS
5 FOREWORD
8 1 Scope and object
2 Thermal interfaces
2.1 Baseline thermal conditions
2.2 Reference temperature
9 2.3 Syntax of surfaces of a generic subrack, chassis or cabinet
Figure 1 – Syntax of surfaces of a forced air cooled generic subrackor chassis to be mounted into a cabinet
Figure 2 – Syntax of surfaces of a forced air cooled generic cabinet
10 2.4 Preferred airflow conditions
Table 1 – Preferred airflow pattern
11 2.5 Cabinet airflow volume and temperature rise management
Figure 3 – Preferred air flow patterns
12 3 Forced air thermal flow chart for cabinet equipment
3.1 General
Figure 4 – Air flow volume management
13 3.2 Evaluation of the actual thermal performance of subrack or chassis
3.3 Cabinet airflow considerations
3.4 Arrangement of subracks and/or chassis equipment within the cabinet
Figure 5 – Forced air thermal flow chart for cabinet equipment
14 3.5 Selection of cabinet mounted forced air device(s)
3.6 Thermal operating environment
Figure 6 – Thermal operating environment (Cabinet sectional side view)
15 Figure 7 – Example of effect of reference temperatureon cabinet operating temperature range
16 Annex A (informative) Limitation of application and background information
17 Figure A.1 – Thermal network model for a plug-in unit in subrack or chassis
18 Bibliography
BSI DD IEC/TS 62610-2:2011
$102.76