BSI DD IEC/TS 62610-2:2011
$102.76
Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Design guide. Method for the determination of forced air-cooling structure
Published By | Publication Date | Number of Pages |
BSI | 2011 | 20 |
This part of IEC 62610 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series.
This design guide contains the following:
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Thermal interfaces of subrack and/or chassis based equipment in a cabinet
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Reference temperature
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Preferred airflow conditions
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Airflow volume conditions
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Standard air
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Procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions
The drawings used are not intended to indicate product design. They are only explanatory indications for determining forced air-cooling structure.
The terminology used complies with IEC 60917-1.
PDF Catalog
PDF Pages | PDF Title |
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4 | English CONTENTS |
5 | FOREWORD |
8 | 1 Scope and object 2 Thermal interfaces 2.1 Baseline thermal conditions 2.2 Reference temperature |
9 | 2.3 Syntax of surfaces of a generic subrack, chassis or cabinet Figure 1 – Syntax of surfaces of a forced air cooled generic subrackor chassis to be mounted into a cabinet Figure 2 – Syntax of surfaces of a forced air cooled generic cabinet |
10 | 2.4 Preferred airflow conditions Table 1 – Preferred airflow pattern |
11 | 2.5 Cabinet airflow volume and temperature rise management Figure 3 – Preferred air flow patterns |
12 | 3 Forced air thermal flow chart for cabinet equipment 3.1 General Figure 4 – Air flow volume management |
13 | 3.2 Evaluation of the actual thermal performance of subrack or chassis 3.3 Cabinet airflow considerations 3.4 Arrangement of subracks and/or chassis equipment within the cabinet Figure 5 – Forced air thermal flow chart for cabinet equipment |
14 | 3.5 Selection of cabinet mounted forced air device(s) 3.6 Thermal operating environment Figure 6 – Thermal operating environment (Cabinet sectional side view) |
15 | Figure 7 – Example of effect of reference temperatureon cabinet operating temperature range |
16 | Annex A (informative) Limitation of application and background information |
17 | Figure A.1 – Thermal network model for a plug-in unit in subrack or chassis |
18 | Bibliography |