BSI PD IEC/TR 60068-3-12:2014
$102.76
Environmental testing – Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
| Published By | Publication Date | Number of Pages |
| BSI | 2014 | 20 |
This part of IEC 60068 , which is a technical report, presents two approaches for establishing a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste.
This process covers a great variety of electronic products, including a large range of package sizes (e.g. molded active electronic components, passive components and electromechanical components).
Study A addresses requirements needed in the production of high-reliability electronic control units (ECU), as for example in automotive electronics. These requirements include measurement and production tolerances.
Study B represents consumer electronics products and includes reflow oven capability, board design and package sizes.
