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BSI PD IEC TR 62878-2-9:2022

$102.76

Device embedding assembly technology – Guidelines. Concept of JISSO level in the electronic assembly technology industries

Published By Publication Date Number of Pages
BSI 2022 18
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 INTRODUCTION
8 1 Scope
2 Normative references
3 Terms
4 Historical Concept of Jisso (JISSO)
4.1 Some examples of terms on Jisso/JISSO used in the past
9 Figures
Figure 1 – Concept of Jisso/JISSO
10 4.2 JISSO level versus Packaging Level (Interconnecting Level)
4.2.1 JISSO Level (typical)
4.2.2 Packaging Level
11 5 Concept of typical terms and description on JISSO Level
5.1 JISSO/Jisso
Figure 2 – Relation between JISSO Level versus Packaging Level
Figure 3 – JISSO Level Concept (1)preliminarily introduced by JNAC in 2004
12 5.2 JISSO Level 0 – Intellectual information
5.3 JISSO Product Level 1 – Electronic element
Figure 4 – JISSO Level Concept (2)
13 Figure 5 – Examples of JISSO Product Level 1 – Electronic element
14 5.4 JISSO Product Level 2 – Electronic package
5.5 JISSO Product Level 3 – Electronic module
Figure 6 – Examples of JISSO Product Level 2 – Electronic package
15 5.6 JISSO Product Level 4 – Electronic unit
Figure 7 – Examples of JISSO Product Level 3 – Electronic module
16 5.7 J ISSO Product Level 5 – Electronic system
Figure 8 – Example of JISSO Product Level 4 – Electronic unit
Figure 9 – Examples of JISSO product Level 5 – Electronic system
17 Bibliography
BSI PD IEC TR 62878-2-9:2022
$102.76