🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
BSI PD IEC/TS 62647-23:2013

BSI PD IEC/TS 62647-23:2013

$189.07

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

Published By Publication Date Number of Pages
BSI 2013 49
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow therepair technician to execute the task.

This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “rework/repair” is used as defined in 3.1.29 and 3.1.30.

The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

NOTE 1 For the purposes of this document, if the element “lead” is implied, it will be stated either as Pb, as lead (Pb), or as tin-lead. If a piece part terminal or termination “lead” is referred to, such as in a flat pack or a dualinline package, the nomenclature lead/terminal or lead-terminal will be used.

NOTE 2 Processes identified in the document apply to either rework or repair. This document may be used by other high-performance and high-reliability industries, at their discretion.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
6 FOREWORD
8 INTRODUCTION
10 1 Scope
2 Normative references
11 3 Terms, definitions and abbreviations
3.1 Terms and definitions
16 3.2 Abbreviations
18 4 Pb-free concerns
4.1 General
4.2 Reliability
4.2.1 General
4.2.2 Mixed metallurgy reliability
19 4.3 Configuration management
20 4.4 Risk management
4.5 Tin whiskers
4.6 Copper dissolution (erosion)
5 Materials
5.1 Solder
5.1.1 General
5.1.2 Solder alloys
21 5.1.3 Solder forms
22 5.2 Fluxes
5.3 Piece parts
5.3.1 General
5.3.2 Termination finishes
5.3.3 Area arrays (BGA, CSP, etc.)
23 5.4 Printed circuit boards/printed wiring boards
5.4.1 Laminate material
5.4.2 Surface finish
5.5 Conformal coatings
24 6 Soldering equipment
6.1 General
6.2 Hand soldering equipment
6.2.1 General hand soldering equipment considerations
6.2.2 Tip selection
25 6.2.3 Soldering iron tip life
Figures
Figure 1 – Soldering iron tip construction
Figure 2 – Worn soldering iron tip
26 6.3 Fountain soldering
Figure 3 – Copper dissolution
27 6.4 Convective soldering equipment
6.4.1 General
6.4.2 Thermal profile issues
28 7 General rework/repair considerations
7.1 General
7.2 Rework/repair procedure order of precedence
29 7.3 Technician training
7.4 Pb-free rework/repair considerations
7.4.1 General
7.4.2 General process considerations
30 7.4.3 Solder processing considerations
7.4.4 Flux considerations
31 8 Pre-rework/repair processes
8.1 Alloy identification
8.1.1 IPC/JEDEC J-STD-609A
32 Tables
Table 1 – Assembly and piece part marking methods
33 8.1.2 X-ray fluorescence (XRF)
8.1.3 Pb swabs
8.2 Piece part and CCA preparation
8.2.1 General
8.2.2 Piece part preparation
34 8.2.3 CCA preparation
9 Rework/repair processes
9.1 General
9.2 Conductive hand soldering
36 9.3 Convective soldering process
9.3.1 General
9.3.2 Solder paste handling
9.3.3 Paste printing
9.3.4 Reflow process
38 10 Post-rework/repair processes
10.1 Cleaning
10.2 Inspection
10.3 Reapplication of conformal coating
39 Annex A (informative) Termination finishes
Table A.1 – Piece-part terminal and BGA ball metallization solder process compatibility risk (see IEC/TS 62647-22:2013)
40 Table A.2 – BGA piece parts risk
41 Annex B (informative) Tin whiskers
43 Table B.1 – Tin whisker information (see IEC/TS 62647-22:2013)
44 Table B.2 – Piece part termination tin whisker risks(see IEC/TS 62647-22:2013)
46 Bibliography

Related products

BSI PD IEC/TS 62647-23:2013
$189.07