DIN EN 62878-2-5:2019 Edition

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Device embedded substrate – Part 2-5: Implementation of a 3D data format for device embedded substrate (Draft)

Published By	Publication Date	Number of Pages
DIN	2019-01	98

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Categories: 31.180 - Printed circuits and boards, 31.190 - Electronic component assemblies, DIN

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Description

This part of IEC 62878 specifies requirements based on XML schema that represents the design data format for device embedded substrate (as known as FUJIKO: Fukuoka University JIsso K(C)Onsortium-format in Japan), that is, active and passive devices embedded board whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material. So far, it is common practice to describe a printed circuit board in lateral dimensions (layer-based methology). If components are embedded in the printed circuit board, it is necessary to describe the lateral and the vertical dimensions of components and their connection(s).

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2019-01
Pages Count	98
Language	Germany
Descriptors	Base materials, Components, Data formats, Definitions, Design, Electrical engineering, Electronic engineering, Electronic equipment and components, Extensible Markup Language, Measurement, Measuring techniques, Microelectronics, Printed circuits, Printed-circuit boards, Quality, Quality assurance, Reliability, Specification (approval), Substrates (insulating), Tridimensional, XML, 3D models
File Size	6.6 MB
ICS Codes	31.180 - Printed circuits and boards 31.190 - Electronic component assemblies