DIN EN IEC 61189-2-803:2019 Edition

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Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-803: Test methods for Z-Axis Expansion of base materials and printed board (Draft)

Published By	Publication Date	Number of Pages
DIN	2019-05	12

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Categories: 31.180 - Printed circuits and boards, DIN

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Description

This part of IEC 61189 specifies a test method to determine the Z-Axis Expansion of laminates and printed boards through the use of a thermomechanical analyzer (TMA).

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2019-05
Pages Count	12
Language	Germany
Descriptors	Analysis, Analyzers, Assemblies, Axles, Base materials, Electrical components, Electrical engineering, Electronic equipment and components, Expansion, Interconnection, Interconnection structures, Laminates, Printed circuits, Printed-circuit boards, Test methods, Testing, Thermomechanical
File Size	553.0 KB
ICS Codes	31.180 - Printed circuits and boards

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DIN EN IEC 61189-2-803:2019 Edition

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