IEC 60749-20-1:2009
$56.55
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques – Partie 20-1: Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l’effet combiné de l’humidité et de la chaleur de brasage
| Published By | Publication Date | Number of Pages |
| IEC | 2009-04-07 | 68 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2009-04-07 |
| Pages Count | 68 |
| Language | France |
| Edition | 1.0 |
| File Size | 1.1 MB |
| ICS Codes | 31.080.01 - Semiconductor devices in general |
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BS EN 60749-20-1:2009
Semiconductor devices. Mechanical and climatic test methods – Handling, packing, labelling and shipping of surface-mount…
