🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
IEC 62137-3:2011

IEC 62137-3:2011

$63.70

Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints

Published By Publication Date Number of Pages
IEC 2011-11-08 94
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Categories: ,

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
– no technical changes;
– some editorial changes and corrections;
– for the sake of convenience some constitutive changes.

Related products

IEC 62137-3:2011
$63.70