IEC TS 62647-2:2012
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Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
| Published By | Publication Date | Number of Pages |
| IEC | 2012-11-29 | 72 |
IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
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