IEEE 1386 2001

$72.04

IEEE Standard for a Common Mezzanine Card Family: CMC

Published By	Publication Date	Number of Pages
IEEE	2001	46

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Description

New IEEE Standard – Inactive – Withdrawn. Administratively withdrawn January 2007 The mechanics of a common mezzanine card (CMC) family are defined in this standard.Mezzanine cards, designed to this standard, can be used interchangeably on VME, VME64 andVME64x boards, CompactPCI boards, Multibus I and II boards, desktop computers, portablecomputers, servers, and other similar types of applications. Mezzanine cards can provide modularfront panel I/O, backplane I/O or general function expansion or a combination for host computers.Single, wide mezzanine cards are 75 mm wide by 150 mm deep by 8.2 mm high.

PDF Catalog

PDF Pages	PDF Title
1	Title Page
3	Introduction
4	Participants
5	CONTENTS
7	1. Overview 1.1 Scope 1.2 Purpose 1.3 General arrangement
8	1.4 Theory and operation of usage
10	1.5 Parent-child standard 1.6 Conformance
11	1.7 Dimensions 1.8 Coordinate dimensions 2. References
12	2.1 Trademarks
13	2.2 Relationship between VME, VMEbus, VME64, VME64x, and CompactPCI 3. Definitions, abbreviations, and terminology 3.1 Special word usage 3.2 Definitions
14	3.3 Abbreviations 3.4 Dimensional nomenclature height, width, and depth 4. Mezzanine card mechanics 4.1 CMC size designations and sizes
15	4.2 EMC envelope 4.3 CMC dimensions
16	4.4 Voltage keying 4.5 Connector pads and labeling
17	4.6 CMC connector 4.7 CMC connector assembled on a CMC
18	4.8 CMC component heights
20	4.9 CMC connector and standoff heights
21	4.10 CMC bezel 4.11 CMC test dimensions 4.12 I/O capability
22	4.13 Power consumption and dissipation
24	4.14 Ground connections 4.15 Electromagnetic compatibility 4.16 Shock and vibration 4.17 Environmental
25	4.18 MTBF 4.19 ESD design 4.20 ESD kit 5. Host CMC slot mechanics
26	5.1 Stacking height above the host PCB 5.2 Host PCB mechanics
28	5.3 Connector pads and labeling 5.4 CMC connectors
30	5.5 CMC connector assembled on a host
31	5.6 Host board side 1 component height
32	5.7 Extra shoulder for 13 mm hosts
33	5.8 Voltage keying pins 5.9 Host front panel or host face plate opening 5.10 Filler panels
36	5.11 Host test dimensions
38	5.12 I/O capability 5.13 Power dissipation 5.14 Grounding connections 5.15 Electromagnetic compatibility
39	5.16 Environmental 6. Electrical and logical layers 6.1 Connector utilization 6.2 CMC connector pin assignments 6.3 Rear I/O mapping
41	6.4 BUSMODE signals