IEEE C57.13.3 2015
$48.75
IEEE Guide for Grounding of Instrument Transformer Secondary Circuits and Cases
Published By | Publication Date | Number of Pages |
IEEE | 2015 | 56 |
Revision Standard – Active. General and specific recommendations for grounding current and voltage transformer secondary circuits and cases of connected equipment are covered in this guide. Although most diagrams included in this guide show relaying applications, the recommended practices apply equally to metering and other areas where instrument transformers are used. Grounding practices presently used, and practices that were not previously reported, are included in this guide. Specifically, a review of other than North American grounding practices is included.
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | IEEE Std C57.13.3™-2014 Front Cover |
3 | Title page |
5 | Important Notices and Disclaimers Concerning IEEE Standards Documents |
8 | Participants |
10 | Introduction |
11 | Contents |
13 | Important Notice 1. Overview 1.1 Background |
14 | 1.2 Scope 1.3 Purpose 2. Normative references |
15 | 3. Definitions 4. Need for grounding secondary circuits of instrument transformers and cases |
16 | 5. Grounding of instrument transformer secondary circuits 5.1 General 5.2 Background 5.3 Ground connection to only one point in the secondary circuit |
17 | 5.4 Recommended point of grounding |
18 | 5.5 Location of connection to ground |
20 | 5.6 Minimum size of conductor for ground connection 5.7 Ground connection isolation test facilities |
33 | 6. Grounding of instrument transformer cases and cases of connected equipment 6.1 Metallic or conductive case grounding 6.2 Internal conductive parts—insulated cases 6.3 Ungrounded metallic or conductive case |
34 | 7. Exceptions to grounding 8. Grounding of low-energy transducers 8.1 General |
35 | 8.2 Interconnection wiring practices |
37 | Annex A (informative) Issues to consider for shielded cable applications for instrument transformers A.1 General A.2 CTs installed over shielded cables, metal bushing collars, or conduits |
40 | Annex B (informative) IEEE, IEC, and other standards reviewed by the I-8—Revision of C57.13.3 Working Group |
42 | Annex C (informative) Examples of problems introduced by simultaneous yard/house grounding in CT/VT circuits C.1 Background C.2 Example 1: Multiple grounds in CT secondary circuits introduced by isolation/test facilities |
46 | C.3 Example 2 – Multiple grounds in VT secondary circuits introduced microprocessor relay surge suppression |
53 | Annex D (informative) Bibliography |
56 | Back Cover |