IPC 1601A:2016

$43.55

Printed Board Handling and Storage Guidelines

Published By	Publication Date	Number of Pages
IPC	2016-06-01	36

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Description

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, and establishing baking profiles for moisture removal. Revision A provides expanded coverage of moisture barrier bags (MBBs), the impact of baking on printed board solderability, ESD issues, moisture concerns for etched cores and composites, desiccant material and HIC cards, and example flowndowns of packaging and handling requirements.

Additional information

Published Code	IPC
Published By	IPC International Inc, formerly Institute for Printed Circuits
Publication Date	2016-06-01
Pages Count	36
Language	English
File Size	4.8 MB
ISBN	978-1-61193-249-2

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IPC 1601A:2016

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