Shopping Cart

No products in the cart.

IPC 2251:2003

$37.05

Design Guide for the Packaging of High Speed Electronic Circuits

Published By Publication Date Number of Pages
IPC 2003-11-01 94
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions.

IPC 2251:2003
$37.05