Shopping Cart

No products in the cart.

IPC 4563:2007

$27.95

Resin Coated Copper Foil for Printed Boards Guideline

Published By Publication Date Number of Pages
IPC 2007-11-01 28
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. Weā€™re here to assist you 24/7.
Email:[email protected]

This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.

IPC 4563:2007
$27.95