IPC 7094A:2018

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Design and Assembly Process Implementation for Flip Chip and Die-Size Components

Published By	Publication Date	Number of Pages
IPC	2018-01-01	96

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Description

IPC 7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach
(DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics
and dictates the appropriate assembly methodology. This standard focuses on design, assembly methodology, critical
inspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-level
ball grid array (WLBGA).

Additional information

Published Code	IPC
Published By	IPC International Inc, formerly Institute for Printed Circuits
Publication Date	2018-01-01
Pages Count	96
Language	English
File Size	8.4 MB
ISBN	978-1-61193-327-7

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IPC 7094A:2018

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