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IPC 7095D-WAM1:2019

IPC 7095D-WAM1:2019

$50.70

Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

Published By Publication Date Number of Pages
IPC 2019-06-01 208
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The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides descriptions on how to successfully implement robust design and assembly processes for printed board assemblies using BGAs as well as ways to troubleshoot some common anomalies which can occur during BGA assembly.

IPC 7095D-WAM1:2019
$50.70