IPC 7525B:2011
$27.95
Stencil Design Guidelines
| Published By | Publication Date | Number of Pages |
| IPC | 2011-10-01 | 34 |
This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
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